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US 12,707,563 B2Granted
Circuit board
AssigneeLG Innotek Co., Ltd.
InventorSang Myung Lee
Life of this patent
Estimating the term…
Abstract
A circuit board according to an embodiment includes an insulating layer including a cavity; and a metal layer disposed on an inner wall of the cavity of the insulating layer, wherein at least one recess concave toward the inside of the insulating layer is formed on an inner wall of the cavity, wherein the metal layer includes: a first metal layer disposed on the inner wall of the cavity while filling the recess; and a second metal layer disposed on the first metal layer and disposed on the inner wall of the cavity.
Claims10
A circuit board comprising:
- an insulating layer;
- and
- an electrode part disposed in the insulating layer,
- wherein the insulating layer includes:
- a plurality of first grooves provided on an upper surface of the insulating layer and spaced apart in a horizontal direction;
- and
- a through hole overlapping at least one of the plurality of first grooves in a vertical direction,
- wherein the electrode part includes:
- a first circuit pattern disposed in the plurality of first grooves;
- and
- a through electrode disposed in the through hole,
- wherein the insulating layer includes a resin and a plurality of fillers disposed in the resin,
- wherein the plurality of fillers include a plurality of embedded fillers embedded in the resin, and a plurality of first exposed fillers exposed through the through hole and in contact with the through electrode,
- wherein an inner wall of the through hole of the insulating layer includes a first portion formed of the resin and etched by plasma treatment, and a second portion formed of the plurality of first exposed fillers and etched by the plasma treatment together with the first portion,
- wherein the through electrode is in contact with the first portion and the second portion, and
- wherein the first portion and the second portion have a surface roughness in a range of 0.5 μm to 1.0 μm.
13 more elements
Dependencies are inferred from the claim text.