Dielectric, copper clad laminate, circuit board, method for manufacturing copper clad laminate
AssigneeNippon Pillar Packing Co., Ltd.
InventorsManami Noda, Naozumi Fukushima, Takeshi Okunaga
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Abstract
To improve electric characteristics of a dielectric for use for a high frequency band. A dielectric 2 formed by lamination of fluorine resin includes a base main layer 3b containing a base material 3a and made of melting fluorine resin, a pair of base cover layers 3c made of melting fluorine resin and formed on both surfaces of the base main layer 3b, and a pair of functional layers 5 made of fluorine resin mixed with hollow fillers 5a and laminated on the outer surfaces of the base cover layers 3c.
Claims11
A dielectric for a circuit board, which is formed by lamination of fluorine resin, comprising:
- a base main layer containing a sheet-shaped base material and made of melting fluorine resin;
- a pair of base cover layers made of melting fluorine resin and formed on both surfaces of the base main layer such that at least outer surfaces thereof are positioned apart from the base material;
- and
- a pair of functional layers made of fluorine resin mixed with a hollow filler including a hollow fine particle and laminated on the outer surfaces of the base cover layers, wherein at 10 GHz, a relative permittivity of the dielectric is 2.1 or less, and a dissipation factor of the dielectric is 0.002 or less.
A method for manufacturing a copper clad laminate including a dielectric formed by lamination of fluorine resin, comprising:
- a step of forming a base main layer by impregnating a base material with melting fluorine resin;
- a step of forming a base cover layer by applying melting fluorine resin onto the base main layer;
- a step of forming a functional layer by impregnating the base material formed with the base main layer and the base cover layer with fluorine resin mixed with a hollow filler including a hollow fine particle;
- a step of acquiring a predetermined molded sheet by cutting prepreg including the base main layer, the base cover layer, and the functional layer into a predetermined size;
- and
- a step of applying copper foil onto a surface of the molded sheet and molding the molded sheet into a plate shape, wherein silica is used as a material of the hollow filler, and treatment of modifying a surface of the hollow filler using a silane-based compound is executed.
Dependencies are inferred from the claim text.