Laminate, laminate with buildup layer, laminate with metal foil, and circuit board

A laminate used for a core layer of a circuit board, wherein

• the laminate does not include a buildup layer,
• the laminate is obtained by laminating a plurality of prepregs including a fiber base material layer and a resin layer (A) so that the prepregs are in direct contact with each other,
• the resin layer (A) contains an inorganic filler and hollow resin particles (1A),
• the 1A hollow resin particles comprise at least one selected from the group consisting of hollow resin particles (1A1) having a shell portion and a hollow portion surrounded by the shell portion and hollow resin particles (1A2) having a hole portion inside each respective particle,
• the 1A1 hollow resin particles are hollow resin particles in which the shell portion contains an aromatic polymer (P1) obtained by polymerizing a monomer composition containing an aromatic crosslinking monomer (a), an aromatic monofunctional monomer (b), and a (meth)acrylic acid ester-based monomer (c) represented by formula (1):
• where
• R1 represents H or CH3,
• R2 represents H, an alkyl group, or a phenyl group,
• R3—O represents an oxyalkylene group having 2 to 18 carbon atoms, and
• m is an average addition molar number of the oxyalkylene group and represents an integer of 1 to 100,
• the 1A2 hollow resin particles are hollow resin particles which contain a polymer (P) containing a structural unit (I) and a structural unit (II):
• the structural unit (I) being at least one selected from the group consisting of structural units derived from a vinyl-based monomer, and
• the structural unit (II) being derived from a phosphoric acid ester-based monomer, and
• the 1A hollow resin particles are contained in the resin layer (A) in an amount of 1% by weight to 50% by weight with respect to the total amount of the resin layer (A).