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US 2025/0126708 A1Published application
Microparticle-filled laminate material
AssigneeDell Products L.P.
InventorsSandor T. FARKAS, Steven R. ETHRIDGE, Bhyrav M. MUTNURY
Life of this patent
Estimating the term…
Abstract
A circuit board may include at least one layer of resin and a plurality of microparticles distributed throughout the at least one layer of resin.
Claims24
A circuit board comprising:
- at least one layer of resin;
- and
- a plurality of microparticles distributed throughout the at least one layer of resin.
An information handling system comprising:
- a processor;
- and
- an information handling resource communicatively coupled to the processor and comprising a circuit board including:
- at least one layer of resin;
- and
- a plurality of microparticles distributed throughout the at least one layer of resin.
3 more elements
A method for making a circuit board, comprising:
- forming at least one layer of the circuit board with resin;
- and
- distributing a plurality of microparticles throughout the at least one layer of resin.
Dependencies are inferred from the claim text.