Fluorinated polymeric composition, fabrication thereof and use thereof
AssigneeInternational Business Machines Corporation
InventorsVoya Markovich, Ashit Mehta, Jae M. Park, Eugene Skarvinko, David W. Wang
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Abstract
Fluorinated polymeric composition exhibiting low dielectric constant and a low coefficient of thermal expansion containing a fluorinated polymeric material and a silica and/or quartz filler having a mean particle size of no greater than 7 microns, and use thereof to form a substrate having vias therein. Layers of the above composition are obtained by applying the composition to a substrate and then heating the composition to a temperature sufficient to cause the composition to fuse.
Claims28
A circuitized substrate free from fibrous fillers and containing
- I. a substrate exhibiting a low dielectric constant and a low coefficient of thermal expansion, which contains:
- A. fluorinated polymeric material;
- and
- B. a filler having a mean particle size of no greater than about 7 .mu.m and being selected from the group of silica, quartz, hollow microspheres and mixtures thereof;
- and wherein the amount of A is about 50 to 90 weight percent, and the amount of B is about 50 to about 10 weight percent;
- based upon the total of A and B in the substrate;
- and
- II. metallic layer being disposed on at least a portion of at least one of the major surfaces of said substrate.
A composition free from fibrous fillers and possessing a low dielectric constant and a low coefficient of thermal expansion which comprises:
- A. fluorinated polymeric material;
- and
- B. a filler having a mean particle size of no greater than about 7 .mu.m and being selected from the group of silica, quartz particles, hollow microspheres and mixtures thereof;
- and wherein the amount of A is about 50 to about 90 weight %, and the amount of B is about 50 to about 10 weight %, based upon the total of A and B in the composition.
A process for fabricating a layer free from fibrous fillers and containing fluorinated polymeric material wherein said layer possesses low dielectric constant and low coefficient of thermal expansion;
- which comprises:
- A. obtaining a composition containing a (1) fluorinated polymeric material;
- and (2) a filler having a mean particle size of no greater than about 7 .mu.m and being selected from the group of silica, quartz particles, hollow microspheres and mixtures thereof;
- and wherein the amount of (1) is about 50 to about 90 weight percent;
- and the amount of (2) is about 50 to about 10 weight %, based upon the total of (1) and (2) in the composition;
- B. applying said composition to a substrate;
- and then
- C. heating the composition to a temperature of about 350.degree. to about 400.degree. C.
Dependencies are inferred from the claim text.