H05K 2201/0257
Nanoparticles
H05K2201/0257 (Nanoparticles) appears on 245 US grants and 375 published applications in this corpus.
Search patents in H05K- Granted patents
- 245
- Published applications
- 375
- Assignees
- 213
- Inventors
- 856
- Latest grant
- 22 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1992 | 1 | 0 |
| 1993 | 1 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 1 | 0 |
| 1997 | 0 | 0 |
| 1998 | 1 | 0 |
| 1999 | 1 | 0 |
| 2000 | 1 | 0 |
| 2001 | 0 | 3 |
| 2002 | 5 | 4 |
| 2003 | 5 | 5 |
| 2004 | 2 | 9 |
| 2005 | 4 | 15 |
| 2006 | 4 | 22 |
| 2007 | 4 | 27 |
| 2008 | 5 | 26 |
| 2009 | 9 | 28 |
| 2010 | 16 | 20 |
| 2011 | 14 | 21 |
| 2012 | 21 | 20 |
| 2013 | 13 | 11 |
| 2014 | 14 | 13 |
| 2015 | 12 | 13 |
| 2016 | 11 | 15 |
| 2017 | 10 | 23 |
| 2018 | 10 | 9 |
| 2019 | 14 | 20 |
| 2020 | 15 | 24 |
| 2021 | 17 | 10 |
| 2022 | 10 | 6 |
| 2023 | 9 | 5 |
| 2024 | 7 | 10 |
| 2025 | 4 | 11 |
| 2026 | 4 | 5 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Wiring board22 Sep 2026US 12,745,348 B2KYOCERA Corporation
- Metal-coated substrates, interposers, and methods for production thereof25 Aug 2026US 12,720,675 B2Kuprion Inc.
- Insulating circuit board and semiconductor device using same25 Aug 2026US 12,721,197 B2Niterra Materials Co., Ltd.
- Heat-curable resin composition5 May 2026US 12,617,941 B2Shin-Etsu Chemical Co., Ltd.
- Scalable method for security barriers23 Dec 2025US 12,506,092 B2Raytheon Company
- Circuit forming method and circuit forming apparatus1 Oct 2026US 2026/0304641 A1Fuji Corporation
- Inlay, Component Carrier, and Method of Manufacturing the Inlay17 Sep 2026US 2026/0282220 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Printed circuit board with healable features25 Jun 2026US 2026/0181767 A1SanDisk Technologies LLC
- Copper-clad laminate having low dielectric constant, low dielectric loss and high thermal conductivity and method for manufacturing the same23 Apr 2026US 2026/0113853 A1CRHM Co., Ltd.
- Conductive Dispersions And Methods Of Manufacture29 Jan 2026US 2026/0028497 A1Nanotech Energy, Inc.
Most cited
By later US patents
- In situ method for forming a capacitive PCB173US 5,261,153 AZycon Corporation · 1993
- Methods for manufacturing electronic and electromechanical elements and devices by thin-film deposition and imaging128US 6,348,295 B1Massachusetts Institute of Technology · 2002
- Printed circuit board having an integrated decoupling capacitive element117US 5,162,977 AStorage Technology Corporation · 1992
- Capacitive PCB with internal capacitive laminate77US 5,870,274 AHadco Santa Clara, Inc. · 1999
- Nanowire-based transparent conductors and applications thereof72US 8,094,247 B2Cambrios Technologies Corporation · 2012