Copper-clad laminate having low dielectric constant, low dielectric loss and high thermal conductivity and method for manufacturing the same
AssigneeCRHM Co., Ltd.
InventorJong Hee KIM
Life of this patent
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Abstract
Disclosed are a copper-clad laminate having a low dielectric constant, low dielectric loss, and high thermal conductivity properties, and a method for manufacturing the same, wherein an insulator substrate having a low dielectric constant, low dielectric loss and high thermal conductivity values is laminated onto a copper-foil layer and a portion of the copper-foil layer is patterned using selective etching such that a circuit pattern having a line width of 40 μm or smaller is designed, such that the copper-clad laminate is used as a digital substrate.
Claims11
A method of manufacturing a copper-clad laminate, the method comprising:
- operation (a) of injecting and coating a ceramic ink composition containing ceramic particles by inkjet printing to form a ceramic insulating film having the ceramic particles uniformly dispersed therein;
- operation (b) of injecting a resin ink composition containing a resin onto the ceramic insulating film by inkjet printing such that the resin ink composition impregnates into pores defined between the ceramic particles;
- operation (c) of heat-treating the ceramic insulating film impregnated with the resin ink composition at 140 to 200° C. for 1 to 6 hours, to form an insulator substrate;
- and
- operation (d) of laminating a copper foil layer on the insulator substrate to form the copper-clad laminate,
- wherein the insulator substrate has a thermal conductivity value in a range of 1.92 to 18 W/mk.
A copper-clad laminate
- wherein the copper-clad laminate includes an insulator substrate and a copper foil layer laminated onto the insulator substrate,
- wherein the insulator substrate includes:
- a ceramic insulating film having ceramic particles uniformly dispersed therein, and
- a resin impregnated into pores defined between the ceramic particles in the ceramic insulating film,
- wherein the insulator substrate includes 5 to 50 vol % of the resin, 0 to 40 vol % of the pores, and the ceramic particles as a remainder,
- wherein the ceramic particles have an average diameter of 10 to 1,000 nm, and
- wherein the insulator substrate has a thermal conductivity value in a range of 1.92 to 18 W/mk.
Dependencies are inferred from the claim text.