Heat-curable resin composition
AssigneeShin-Etsu Chemical Co., Ltd.
InventorYoshinori Inokuchi
Life of this patent
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Abstract
Provided is a heat-curable resin composition capable of lowering the elastic modulus of a cured product obtained even when a heat-curable resin component in the composition contains an organic solvent or has a high curing temperature. The heat-curable resin composition contains: (A) a heat-curable resin; and (B) spherical polymethylphenyl silsesquioxane particles that have a volume average particle size of 0.1 to 30 μm, and are in an amount of 1 to 35 parts by mass per 100 parts by mass of the component (A), wherein a molar ratio between units represented by CH3SiO3/2 and units represented by C6H5SiO3/2 (CH3SiO3/2 units:C6H5SiO3/2 units) in the polymethylphenyl silsesquioxane particles is 95:5 to 55:45.
Claims9
A heat-curable resin composition comprising:
- (A) a heat-curable resin;
- and
- (B) spherical polymethylphenyl silsesquioxane particles that have a volume average particle size of 0.1 to 30 μm, and are in an amount of 1 to 35 parts by mass per 100 parts by mass of the component (A),
- wherein a molar ratio between units represented by CH3SiO3/2 and units represented by C6H5SiO3/2 (CH3SiO3/2 units:C6H5SiO3/2 units) in the polymethylphenyl silsesquioxane particles is 95:5 to 55:45,
- the heat-curable resin as the component (A) is at least one selected from an epoxy resin, a phenolic resin, a cyanate resin and a maleimide resin, and
- the component (B) causes a cured product of the heat-curable resin composition to lower the elastic modulus of the cured product.
Dependencies are inferred from the claim text.