Inlay, Component Carrier, and Method of Manufacturing the Inlay
AssigneeAT&S Austria Technologie & Systemtechnik Aktiengesellschaft
InventorHans PARK
Life of this patent
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Abstract
An inlay includes a first electrically insulating material layer having at least one first via; a second electrically insulating material layer having at least one second via; and a central layer arranged between the first electrically insulating material layer and the second electrically insulating material layer, wherein the first via and/or the second via extend at least partially into the central layer.
Claims26
An inlay, comprising:
- a first electrically insulating material layer comprising at least one first via;
- a second electrically insulating material layer comprising at least one second via;
- and
- a central layer arranged between the first electrically insulating material layer and the second electrically insulating material layer,
- wherein the first via and/or the second via extend at least partially into the central layer.
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A component carrier, comprising:
- at least one electrically insulating layer structure and/or at least one electrically conducting layer structure, and
- at least one inlay including a first electrically insulating material layer comprising at least one first via;
- a second electrically insulating material layer comprising at least one second via;
- and
- a central layer arranged between the first electrically insulating material layer and the second electrically insulating material layer,
- wherein the first via and/or the second via extend at least partially into the central layer.
A method of manufacturing an inlay, comprising the following steps:
- providing a first electrically insulating material layer comprising at least one first via;
- providing a second electrically insulating material layer comprising at least one second via;
- providing a central layer and arranging the central layer between the first electrically insulating material layer and the second electrically insulating material layer,
- wherein the first via and/or the second via extends at least partially into the central layer.
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Dependencies are inferred from the claim text.