H05K 2201/0251
Non-conductive microfibers
H05K2201/0251 (Non-conductive microfibers) appears on 75 US grants and 53 published applications in this corpus.
Search patents in H05K- Granted patents
- 75
- Published applications
- 53
- Assignees
- 55
- Inventors
- 216
- Latest grant
- 17 Mar 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1980 | 1 | 0 |
| 1981 | 1 | 0 |
| 1982 | 2 | 0 |
| 1983 | 1 | 0 |
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 4 | 0 |
| 1988 | 1 | 0 |
| 1989 | 7 | 0 |
| 1990 | 2 | 0 |
| 1991 | 2 | 0 |
| 1992 | 3 | 0 |
| 1993 | 3 | 0 |
| 1994 | 2 | 0 |
| 1995 | 1 | 0 |
| 1996 | 1 | 0 |
| 1997 | 1 | 0 |
| 1998 | 0 | 0 |
| 1999 | 3 | 0 |
| 2000 | 2 | 0 |
| 2001 | 4 | 1 |
| 2002 | 2 | 4 |
| 2003 | 2 | 3 |
| 2004 | 1 | 4 |
| 2005 | 3 | 2 |
| 2006 | 3 | 1 |
| 2007 | 0 | 3 |
| 2008 | 2 | 4 |
| 2009 | 1 | 7 |
| 2010 | 3 | 5 |
| 2011 | 0 | 2 |
| 2012 | 6 | 3 |
| 2013 | 3 | 0 |
| 2014 | 1 | 4 |
| 2015 | 1 | 2 |
| 2016 | 1 | 2 |
| 2017 | 2 | 2 |
| 2018 | 0 | 0 |
| 2019 | 0 | 0 |
| 2020 | 0 | 2 |
| 2021 | 1 | 0 |
| 2022 | 0 | 0 |
| 2023 | 0 | 0 |
| 2024 | 0 | 0 |
| 2025 | 0 | 1 |
| 2026 | 1 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Prepreg, and metal-clad laminated board and wiring substrate obtained using same17 Mar 2026US 12,581,593 B2Panasonic Intellectual Property Management Co., Ltd.
- Connector device14 Dec 2021US 11,202,373 B2Autonetworks Technologies, Ltd.
- Method of glass fabric production including resin adhesion for printed circuit board formation28 Nov 2017US 9,827,590 B2International Business Machines Corporation
- Methods for assembling electronic devices with adhesive7 Feb 2017US 9,565,773 B2Apple Inc.
- Process to produce conformal nano-composite coating for mititgation of manufacturing defects using chemical vapor deposition and nano-structures26 Apr 2016US 9,326,384 B2The United States of America as represented by the Secretary of the Navy
- Laminate and method for forming laminate20 Aug 2026US 2026/0241412 A1Daikin Industries, Ltd.
- Automated manufacturing of hybrid panels4 Dec 2025US 2025/0374426 A1Intel Corporation
- Connector device1 Oct 2020US 2020/0315026 A1Autonetworks Technologies, Ltd.
- Prepreg, and metal-clad laminated board and wiring substrate obtained using same16 Jul 2020US 2020/0223998 A1Panasonic Intellectual Property Management Co., Ltd.
- Prepreg, printed circuit board including prepreg, and method of fabricating the same23 Mar 2017US 2017/0086290 A1Samsung Electro-Mechanics Co., Ltd.
Most cited
By later US patents
- Electrical substrate material100US 4,849,284 ARogers Corporation · 1989
- Microfiber dielectrics which facilitate laser via drilling87US 6,224,965 B1Honeywell International Inc. · 2001
- Microwave circuit boards76US 4,335,180 ARogers Corporation · 1982
- Flexible circuit laminate and method of making the same55US 4,634,631 ARogers Corporation · 1987
- Heat-resistant synthetic fiber sheet48US 7,026,033 B2Teijin Techno Products Limited · 2006