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US 2017/0086290 A1Published application
Prepreg, printed circuit board including prepreg, and method of fabricating the same
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsKeun-Yong LEE, Jun-Young KIM, Sa-Yong LEE, Sang-Hyun SHIN
Life of this patent
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Abstract
A prepreg, a printed circuit board and a method of manufacturing the same are provided. A prepreg includes a core layer including nanofibers having a thickness in a range of 10 to 100 nm, a first insulating layer on a first surface of the core layer, and a second insulating layer on a second surface of the core layer.
Claims20
A prepreg comprising:
- a core layer comprising nanofibers having a thickness in a range of 10 to 100 nm;
- a first insulating layer on a first surface of the core layer;
- and
- a second insulating layer on a second surface of the core layer.
1 more element
A method for manufacturing a prepreg, the method comprising:
- obtaining a first insulating layer disposed on a copper foil;
- forming a core layer comprising nanofibers on the first insulating layer;
- and
- forming a second insulating layer on the core layer.
1 more element
A method for manufacturing a prepreg, the method comprising:
- electrospinning nanofibers on a first insulating layer to form a core layer;
- and
- forming a second insulating layer on the core layer.
Dependencies are inferred from the claim text.