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US 4,849,284 AGranted
Electrical substrate material
AssigneeRogers Corporation
InventorsDavid J. Arthur, John C. Mosko, Connie S. Jackson, G. Robert Traut
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AssigneeRogers Corporation
InventorsDavid J. Arthur, John C. Mosko, Connie S. Jackson, G. Robert Traut
Estimating the term…
A ceramic filled fluoropolymer-based electrical substrate material well suited for forming rigid printed wiring board substrate materials and integrated circuit chip carriers is presented which exhibits improved electrical performance over other printed wiring board materials and circuit chip carriers. Also, the low coefficients of thermal expansion and compliant nature of this electrical substrate material results in improved surface mount reliability and plated through-hole reliability. The electrical substrate material preferably comprises polytetrafluoroethylene filled with silica along with a small amount of microfiberglass. In an important feature of this invention, the ceramic filler (silica) is coated with a silane coating material which renders the surface of the ceramic hydrophobic and provides improved tensile strength, peel strength and dimensional stability.
An electrical substrate material comprising:
In a multilayer circuit including at least a first circuit layer and a second circuit layer, the improvement comprising:
An electrical substrate material comprising:
In a multilayer circuit including at least a first circuit layer and a second circuit layer, the improvement comprising:
Dependencies are inferred from the claim text.