Microfiber dielectrics which facilitate laser via drilling
AssigneeHoneywell International Inc.
InventorsDavid R. Haas, Chengzeng Xu, Mavyn McAuliffe
Life of this patent
Estimating the term…
Abstract
This invention concerns electronic substrates comprising a non-woven filler material and a resin material. The present invention also includes electronic products manufactured from the electronic substrates of this invention including, but not limited to prepregs, metal clad laminates, and printed wiring boards with and without lased via holes. The present invention further includes a method of manufacturing printed built-up wiring boards including the steps of forming a prepreg and forming at least one via in the prepreg.
Claims7
A lasable prepreg for use in fabrication of build-up multilayer printed wiring boards comprising:
- a. a non-woven matrix of glass micro-fibers, in which the glass micro-fibers have a diameter of less than about two microns;
- and
- b. a partially cured polymer.
Dependencies are inferred from the claim text.