H05K 2201/0206
Materials
H05K2201/0206 (Materials) appears on 2,499 US grants and 2,799 published applications in this corpus.
Search patents in H05K- Granted patents
- 2,499
- Published applications
- 2,799
- Assignees
- 958
- Inventors
- 6,158
- Latest grant
- 22 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 5 | 0 |
| 1977 | 5 | 0 |
| 1978 | 6 | 0 |
| 1979 | 2 | 0 |
| 1980 | 6 | 0 |
| 1981 | 13 | 0 |
| 1982 | 7 | 0 |
| 1983 | 10 | 0 |
| 1984 | 12 | 0 |
| 1985 | 9 | 0 |
| 1986 | 12 | 0 |
| 1987 | 26 | 0 |
| 1988 | 22 | 0 |
| 1989 | 28 | 0 |
| 1990 | 26 | 0 |
| 1991 | 31 | 0 |
| 1992 | 37 | 0 |
| 1993 | 29 | 0 |
| 1994 | 39 | 0 |
| 1995 | 31 | 0 |
| 1996 | 44 | 0 |
| 1997 | 42 | 0 |
| 1998 | 52 | 0 |
| 1999 | 54 | 0 |
| 2000 | 49 | 0 |
| 2001 | 71 | 29 |
| 2002 | 74 | 101 |
| 2003 | 77 | 100 |
| 2004 | 76 | 108 |
| 2005 | 65 | 155 |
| 2006 | 66 | 136 |
| 2007 | 69 | 156 |
| 2008 | 70 | 156 |
| 2009 | 87 | 174 |
| 2010 | 83 | 183 |
| 2011 | 97 | 132 |
| 2012 | 107 | 114 |
| 2013 | 92 | 78 |
| 2014 | 76 | 130 |
| 2015 | 66 | 130 |
| 2016 | 86 | 94 |
| 2017 | 73 | 80 |
| 2018 | 77 | 82 |
| 2019 | 77 | 75 |
| 2020 | 52 | 86 |
| 2021 | 63 | 87 |
| 2022 | 57 | 91 |
| 2023 | 69 | 86 |
| 2024 | 57 | 109 |
| 2025 | 69 | 72 |
| 2026 | 46 | 55 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
- H05K 2201/0209Inorganic, non-metallic particlesIndexing code1,618
- H05K 2201/0212Resin particlesIndexing code316
- H05K 2201/0215Metallic fillersIndexing code282
- H05K 2201/0239Coupling agent for particlesIndexing code159
- H05K 2201/0221Insulating particles having an electrically conductive coatingIndexing code128
- H05K 2201/0218Composite particles, i.e. first metal coated with second metalIndexing code127
- H05K 2201/0224Conductive particles having an insulating coatingIndexing code121
- H05K 2201/0236Plating catalyst as filler in insulating materialIndexing code106
Recent patents
- Wiring board22 Sep 2026US 12,745,348 B2KYOCERA Corporation
- Resin composition and prepreg, film with resin, metal foil with resin, metal-clad laminated plate, and wiring board using same15 Sep 2026US 12,735,543 B2Panasonic Intellectual Property Management Co., Ltd.
- Metal-coated substrates, interposers, and methods for production thereof25 Aug 2026US 12,720,675 B2Kuprion Inc.
- Device having an in-substrate inductor and method for making the inductor25 Aug 2026US 12,720,774 B2QUALCOMM Incorporated
- Camera module packaging structure and electronic device having the same18 Aug 2026US 12,713,521 B2Triple Win Technology(Shenzhen) Co. Ltd.
- Flexible laminate material1 Oct 2026US 2026/0295973 A1The Chemours Company Fc, LLC
- Thermosetting resin composition, prepreg, resin film, metal-clad laminate, printed wiring board, antenna device, antenna module, and communication device24 Sep 2026US 2026/0285008 A1Resonac Corporation
- Resin composition, prepreg, laminate, resin film, printed wiring board, and semi-conductor package24 Sep 2026US 2026/0286119 A1Resonac Corporation
- Inlay, Component Carrier, and Method of Manufacturing the Inlay17 Sep 2026US 2026/0282220 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Resin composition, prepreg, layered sheet, printed circuit board, and semiconductor package17 Sep 2026US 2026/0282221 A1Resonac Corporation
Most cited
By later US patents
- LED lamp assembly with means to conduct heat away from the LEDS470US 6,045,240 ARelume Corporation · 2000
- Vehicle lamp411US 5,038,255 AFurukawa Electric Co., Ltd. · 1991
- Thermally protected LED array337US 5,785,418 A1998
- Semiconductor package280US 8,921,990 B2Samsung Electronics Co., Ltd. · 2014
- Component built-in module and method for producing the same277US 6,734,542 B2Matsushita Electric Industrial Co., Ltd. · 2004