H05K 2201/0227
Insulating particles having an insulating coating
H05K2201/0227 (Insulating particles having an insulating coating) appears on 23 US grants and 28 published applications in this corpus.
Search patents in H05K- Granted patents
- 23
- Published applications
- 28
- Assignees
- 17
- Inventors
- 80
- Latest grant
- 6 Feb 2024
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2002 | 1 | 1 |
| 2003 | 0 | 0 |
| 2004 | 0 | 0 |
| 2005 | 0 | 0 |
| 2006 | 0 | 0 |
| 2007 | 0 | 0 |
| 2008 | 0 | 0 |
| 2009 | 0 | 0 |
| 2010 | 0 | 1 |
| 2011 | 0 | 0 |
| 2012 | 0 | 1 |
| 2013 | 1 | 1 |
| 2014 | 0 | 2 |
| 2015 | 1 | 4 |
| 2016 | 2 | 2 |
| 2017 | 4 | 4 |
| 2018 | 2 | 2 |
| 2019 | 4 | 3 |
| 2020 | 1 | 2 |
| 2021 | 2 | 1 |
| 2022 | 2 | 3 |
| 2023 | 2 | 0 |
| 2024 | 1 | 1 |
By publication year.
Recent patents
- Printed circuit board substrate comprising a coated boron nitride6 Feb 2024US 11,895,768 B2Rogers Corporation
- Prepreg, metal-clad laminated board, and printed wiring board9 May 2023US 11,647,583 B2Panasonic Intellectual Property Management Co., Ltd.
- Metal-clad laminate and printed wiring board25 Apr 2023US 11,638,349 B2Panasonic Intellectual Property Management Co., Ltd.
- Resin composition, and pre-preg, metal-clad laminate and printed circuit board prepared using the same24 May 2022US 11,339,258 B2Taiwan Union Technology Corporation
- Printed circuit board and insulating film used therein17 May 2022US 11,337,305 B1Samsung Electro-Mechanics Co., Ltd.
- Carrier structure, method for producing a carrier structure and device and printhead for carrying out such a method18 Jul 2024US 2024/0244760 A1ams-OSRAM International GmbH
- Metal-clad laminate and printed wiring board3 Nov 2022US 2022/0353988 A1Panasonic Intellectual Property Management Co., Ltd.
- Printed circuit board substrate comprising a coated boron nitride6 Oct 2022US 2022/0322517 A1Rogers Corporation
- Printed circuit board and insulating film used therein9 Jun 2022US 2022/0183155 A1Samsung Electro-Mechanics Co., Ltd.
- Thermally conductive composite particles, method for producing same, insulating resin composition, insulating resin molded body, laminate for circuit boards, metal base circuit board and power module21 Jan 2021US 2021/0017084 A1NHK Spring Co., Ltd.
Most cited
By later US patents
- Composites of powdered fillers and polymer matrix27US 6,391,082 B1Holl Technologies Company · 2002
- Landless via concept4US 10,182,494 B1Flex Ltd. · 2019
- Catalytic laminate apparatus and method3US 9,706,650 B1Sierra Circuits, Inc. · 2017
- Electrical component resin, semiconductor device, and substrate1US 9,265,144 B2Panasonic Intellectual Property Management Co., Ltd. · 2016
- Resin composition, prepreg, metal foil-clad laminate and printed wiring board1US 9,832,870 B2Mitsubishi Gas Chemical Company, Inc. · 2017