Prepreg, metal-clad laminated board, and printed wiring board

A prepreg comprising:

• a base material containing a reinforcing fiber;
• and
• a semi-cured product of a resin composition impregnated into the base material containing a reinforcing fiber, wherein:
• the prepreg after cured has a glass transition temperature (Tg) which is higher than or equal to 150° C. and lower than or equal to 220° C.,
• the resin composition comprises:
• an (A) component containing a thermosetting resin;
• and
• a (B) component containing a polymer component having a weight average molecular weight of 350000 or more, the polymer component having a structure represented by the following formula (3):
• where z represents an integer larger than 0, R3 represents a hydrogen atom or a methyl group, and R4 represents at least one group selected from the group consisting of -Ph (a phenyl group), —COOCH2Ph, and —COO(CH2)2Ph,
• an amount of the (B) component is higher than or equal to 75 parts by mass and lower than or equal to 100 parts by mass with respect to 100 parts by mass of the (A) component,
• the (B) component further contains core shell rubber, and
• a thickness of the prepreg is in a range from 0.010 mm to 0.200 mm.