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US 9,265,144 B2Granted
Electrical component resin, semiconductor device, and substrate
AssigneePanasonic Intellectual Property Management Co., Ltd.
InventorsMasanori Minamio, Hiroki Ikeuchi
Life of this patent
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Abstract
A semiconductor device is a resin package structure including a semiconductor element T1 molded with a first resin 6. The first resin 6 contains a filler 7 including an electrical insulating capsule enclosed with a phase-change-material that absorbs ambient heat and phase-changes so as to increase a dielectric-strength. The effect of the filler 7 achieves a structure with satisfactory heat dissipation and a high withstand voltage.
Claims13
An electrical component resin comprising:
- a plurality of particles of a phase-change-material that phase-changes by heat absorption;
- the plurality of phase-change-material particles being individually encapsulated with a first electrical insulating material that encloses the phase-change-material to form capsules, with a diameter between 2 micrometers and 100 micrometers;
- a layer provided between each capsule and the encapsulated phase-change-material and partially enclosing the phase-change-material;
- and a resin formed of a second electrical insulating material and enclosing the capsules;
- wherein the layer is composed of inert gas different from the phase-change-material;
- a substrate comprising an electric circuit composed of layers of the electrical component resin, the electrical component resin containing one of an electrical component and a conductor pattern, the layers being stacked sequentially or with an intermediate layer interposed between the layers.
3 more elements
Dependencies are inferred from the claim text.