Catalytic laminate apparatus and method

A process for forming a catalytic pre-preg laminate having a resin rich surface which excludes catalytic particles an exclusion depth below said resin rich surface, the process comprising:

• forming a catalytic resin by blending catalytic particles into a resin and a solvent;
• infusing the catalytic resin into a fabric;
• rolling the catalytic resin infused fabric to a desired first thickness;
• baking the catalytic infused resin until most of the solvents are removed;
• placing the baked catalytic pre-preg into a lamination press having substantially planar pressure surfaces;
• heating under vacuum the catalytic pre-preg while applying a lamination pressure, varying the temperature of the lamination press to provide a heating ramp to a dwell temperature which maintains a gel point, maintaining the dwell temperature for a dwell time sufficient for the catalytic particles to migrate away from the outer surfaces of the catalytic pre-preg, and thereafter reducing the temperature in a cooling cycle;
• where the dwell time, the dwell temperature, and the lamination pressure are selected to cause the catalytic particles to be excluded in a region below said resin rich surface.

A method for forming a via in a non-catalytic dielectric material having a first layer of copper applied to a first surface of said non-catalytic dielectric material and an optional second layer of copper applied to a surface opposite said first surface, said first layer of copper optionally patterned to include at least one trace and at least one pad formed on said first layer of copper, the method comprising:

• forming a hole having a first diameter through said first layer of copper and said dielectric, and optionally through said second layer of copper;
• placing a catalytic resin in said formed hole, said catalytic resin comprising a resin mixed with catalytic particles;
• forming a second hole in said catalytic resin, said second hole having a diameter less than said first hole, said second hole thereby exposing catalytic particles of said catalytic resin;
• placing said non-catalytic dielectric into an electroless copper bath, said electroless copper bath thereby depositing copper (Cu) on said first layer of copper, said first layer pad, the inner surface of said second hole, and optionally, said second layer of copper.

A circuit board comprising:

• a non-catalytic dielectric having a copper layer applied to at least one surface;
• said copper layer including an aperture having an inner diameter;
• said aperture inner diameter and said copper layer having a deposition film of copper forming an electrical connection;
• said inner diameter surrounded by an annular ring of catalytic material formed between said inner diameter and an aperture in said non-catalytic dielectric.