Loading patent…
AssigneePanasonic Intellectual Property Management Co., Ltd.
InventorsDai Sasaki, Yasunori Nishiguchi, Kazuki Matsumura, Yohsuke Ishikawa, Hiroki Tamiya, Koji Kishino
Estimating the term…
A metal-clad laminate includes: an insulating layer; and a metal layer stacked on the insulating layer. The insulating layer includes: a first layer; and a second layer interposed between the first layer and the metal layer. The first layer contains a cured product of a first resin composition containing composite particles. The second layer contains a cured product of a second resin composition. The first resin composition contains composite particles, each having a core containing a fluororesin and a shell containing a silicon oxide that coats the core at least partially. The second resin composition may or may not contain composite particles. When the second resin composition contains the composite particles, a ratio of the composite particles in the second resin composition to solid content of the second resin composition is lower than a ratio of the composite particles in the first resin composition to solid content of the first resin composition.
A metal-clad laminate comprising:
A printed wiring board comprising:
Dependencies are inferred from the claim text.