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US 2022/0183155 A1Published application
Printed circuit board and insulating film used therein
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorDong Joo SHIN
Life of this patent
Estimating the term…
Abstract
A printed circuit board includes: an insulating layer including an insulating resin and first fillers dispersed in the insulating resin; and a wiring layer disposed on the insulating layer. The first filler includes a core, and a shell coated on a surface of the core, and the shell has a dielectric constant higher than that of the core.
Claims27
A printed circuit board comprising:
- an insulating layer including an insulating resin and first fillers dispersed in the insulating resin;
- and
- a wiring layer disposed on the insulating layer,
- wherein the first filler includes a core, and a shell coated on a surface of the core, and
- the shell has a dielectric constant higher than that of the core.
2 more elements
A printed circuit board comprising:
- a plurality of insulating layers;
- a plurality of wiring layers disposed on or between the plurality of insulating layers;
- and
- a via layer penetrating through at least one of the plurality of insulating layers and connecting the plurality of wiring layers to each other,
- wherein at least one of the plurality of insulating layers includes an insulating sheet and insulating resins disposed on both surfaces of the insulating sheet,
- the insulating resins and the insulating sheet include first and second fillers, respectively, and
- a density of the second fillers per unit volume in the insulating sheet is higher than that of the first fillers per unit volume in each of the insulating resins.
4 more elements
An insulating film comprising:
- an insulating resin;
- and
- fillers dispersed in the insulating resin and each including a core, and a shell coated on a surface of the core,
- wherein the shell has a dielectric constant higher than that of the core, and
- the shell has a coefficient of thermal expansion (CTE) greater than that of the core.
2 more elements
A printed circuit board comprising:
- an insulating layer including an insulating resin and first fillers dispersed in the insulating resin;
- and
- a wiring layer disposed on the insulating layer,
- wherein the first filler includes a core including a first material, and a shell coated on a surface of the core and including a second material, and
- one of the first material and the second material has a dielectric constant and a coefficient of thermal expansion (CTE) greater than the other of the first material and the second material.
2 more elements
A printed circuit board comprising:
- a first wiring layer and a second wiring layer;
- a first insulating resin layer and a second insulating resin layer disposed between the first wiring layer and the second wiring layer and each dispersed with fillers, wherein the fillers includes a core and a shell coated on the core and having a dielectric constant or a coefficient of thermal expansion (CTE) different from that of the core;
- an insulating sheet disposed between the first insulating resin layer and the second insulating resin layer;
- and
- a via layer extending between the first wiring layer and the second wiring layer and penetrating through the first insulating resin layer, the insulating sheet, and the second insulating resin layer.
2 more elements
Dependencies are inferred from the claim text.