Resin composition, prepreg, metal foil-clad laminate and printed wiring board

A resin composition comprising an epoxy resin (A), a cyanate ester compound (B), an inorganic filler (C), wherein the inorganic filler (C) comprises a surface-treated silicon carbide (C-1) of a silicon carbide powder having the surface treated with an inorganic oxide, and a maleimide compound (D) selected from at least one or more of the group consisting of bis(4-maleimidophenyl)methane, 2,2-bis(4-(4-maleimidephenoxy)-phenyl)propane, bis(3-ethyl-5-methyl-4-maleimidophenyl)methane, and a maleimide compound represented by the following formula (4):

• wherein each R independently represents a hydrogen atom or a methyl group, and n represents an integer of 1 to 10 as an average value;
• and
• wherein the inorganic filler (C) is contained in an amount of 150 to 900 parts by mass based on a total of 100 parts by mass of resin solid components.