H05K 2201/0218
Composite particles, i.e. first metal coated with second metal
H05K2201/0218 (Composite particles, i.e. first metal coated with second metal) appears on 127 US grants and 140 published applications in this corpus.
Search patents in H05K- Granted patents
- 127
- Published applications
- 140
- Assignees
- 92
- Inventors
- 372
- Latest grant
- 28 Oct 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1986 | 1 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 3 | 0 |
| 1994 | 1 | 0 |
| 1995 | 1 | 0 |
| 1996 | 4 | 0 |
| 1997 | 2 | 0 |
| 1998 | 5 | 0 |
| 1999 | 2 | 0 |
| 2000 | 4 | 0 |
| 2001 | 5 | 1 |
| 2002 | 7 | 6 |
| 2003 | 2 | 7 |
| 2004 | 4 | 6 |
| 2005 | 4 | 4 |
| 2006 | 2 | 5 |
| 2007 | 2 | 12 |
| 2008 | 5 | 3 |
| 2009 | 6 | 11 |
| 2010 | 4 | 10 |
| 2011 | 4 | 9 |
| 2012 | 8 | 9 |
| 2013 | 6 | 4 |
| 2014 | 5 | 9 |
| 2015 | 5 | 9 |
| 2016 | 7 | 7 |
| 2017 | 3 | 4 |
| 2018 | 3 | 1 |
| 2019 | 3 | 3 |
| 2020 | 3 | 7 |
| 2021 | 3 | 1 |
| 2022 | 1 | 5 |
| 2023 | 5 | 1 |
| 2024 | 0 | 4 |
| 2025 | 6 | 1 |
| 2026 | 0 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Applying a solderable surface to conductive ink28 Oct 2025US 12,457,693 B2International Business Machines Corporation
- Through mold via frame20 May 2025US 12,308,307 B2Rockley Photonics Limited
- Resin composition, copper foil with resin, dielectric layer, copper-clad laminate, capacitor element, and printed wiring board with built-in capacitor13 May 2025US 12,297,354 B2Mitsui Mining & Smelting Co., Ltd.
- Conductive particles and connection structure29 Apr 2025US 12,288,629 B2Sekisui Chemical Co., Ltd.
- Display device and method of manufacturing the same4 Mar 2025US 12,243,844 B2Samsung Display Co., Ltd.
- Photosensitive resin film, printed wiring board, and semiconductor package4 Jun 2026US 2026/0153804 A1Resonac Corporation
- Conductive adhesive layer and heat dissipation structure10 Jul 2025US 2025/0223471 A1Tatsuta Electric Wire & Cable Co., Ltd.
- Method for Producing a Solder Connection and Assembly with a Solder Connection19 Dec 2024US 2024/0416443 A1Siemens Aktiengesellschaft
- Carrier structure, method for producing a carrier structure and device and printhead for carrying out such a method18 Jul 2024US 2024/0244760 A1ams-OSRAM International GmbH
- Applying a solderable surface to conductive ink15 Feb 2024US 2024/0057266 A1International Business Machines Corporation
Most cited
By later US patents
- Method of forming an adhesive connection136US 6,077,380 AMicroFab Technologies, Inc. · 2000
- Electrically and thermally conductive adhesive transfer tape128US 4,606,962 AMinnesota Mining and Manufacturing Company · 1986
- Method of making subsurface electronic circuits121US 5,531,020 APoly-Flex Circuits, Inc. · 1996
- Conductive adhesive film techniques83US 5,225,966 AAT&T Bell Laboratories · 1993
- Thermally conducting materials and applications for microelectronic packaging81US 6,114,413 AInternational Business Machines Corporation · 2000