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US 12,288,629 B2Granted
Conductive particles and connection structure
AssigneeSekisui Chemical Co., Ltd.
InventorYuto Dobashi
Life of this patent
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Abstract
A conductive particle including a base particle and a conductive portion disposed on a surface of the base particle, in which a particle diameter of the conductive particle is 30 μm or more, and a ratio of a resistance value (R20) of the conductive particle after loading and unloading up to 20% compression deformation of the conductive particle are repeated 20 times to a resistance value (R1) of the conductive particle after loading and unloading up to 20% compression deformation of the conductive particle are performed once is 1.5 or less.
Claims14
A conductive particle comprising:
- a base particle;
- and
- a conductive portion disposed on a surface of the base particle,
- a particle diameter of the conductive particle being 30 μm or more, and
- a ratio of a resistance value (R20) of the conductive particle to a resistance value (R1) of the conductive particle being 1.5 or less,
- wherein, provided that a process of applying a load at a smooth indenter end face of a cylinder at 25° C. until the conductive particle is 20% compressed and deformed in a center direction of the conductive particle and performing unloading is defined as 1 cycle, the resistance value (R20) of the conductive particle is measured after performing a compression test of 20 cycles in total, and the resistance value (R1) of the conductive particle is measured after performing a compression test of 1 cycles.
3 more elements
A conductive particle comprising:
- a base particle;
- and
- a conductive portion disposed on a surface of the base particle,
- a particle diameter of the conductive particle being 30 μm or more, and
- no bent portion being present in a displacement compressive load curve in a compression test in which loading and unloading up to 20% compression deformation of the conductive particle are repeated 20 times.
2 more elements
Dependencies are inferred from the claim text.