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US 6,077,380 AGranted
Method of forming an adhesive connection
AssigneeMicroFab Technologies, Inc.
InventorsDonald J. Hayes, Mary W. Hartnett
Life of this patent
Estimating the term…
Abstract
Solid spheres of substantially uniform size and shape and coated with a lower temperature melting material are formed for use in interconnect arrays, solder pastes, Z-axis conduction adhesives, etc. Drops of two materials are merged in flight forming a coating of the lower melting temperature material on the drop of higher melting temperature material.
Claims5
The method of forming an adhesive connection between two opposing substantially parallel surfaces comprising the steps of:
- (a) coating a plurality of substantially spherical individual bodies of a first material with a substantially uniform coating of adhesive to form a plurality of individual bodies, each having a core of said first material and a coating of adhesive;
- (b) positioning a plurality of said individual bodies in a first layer on a first surface;
- (c) positioning a plurality of said individual bodies in a second layer on said first layer;
- (d) positioning a second surface on said second layer;
- and
- (e) compressing said layers between said surfaces until the cores of said individual bodies physically contact each other and said adhesive material forms a bond connecting said first surface to said second surface.
3 more elements
Dependencies are inferred from the claim text.