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US 12,308,307 B2Granted
Through mold via frame
AssigneeRockley Photonics Limited
InventorsSeungjae Lee, Brett Sawyer, Gerald Cois Byrd
Life of this patent
Estimating the term…
Abstract
A via frame. In some embodiments, the via frame includes: a sheet of epoxy mold compound, having a plurality of holes each extending through the sheet of epoxy mold compound, and a plurality of conductive elements, each extending through a respective one of the holes.
Claims19
An interposer, comprising:
- a photonic integrated circuit comprising a waveguide on a top surface of the photonic integrated circuit;
- and a via frame on the top surface of the photonic integrated circuit, and comprising:
- a sheet of epoxy mold compound, having a plurality of holes each extending through the sheet of epoxy mold compound, and a plurality of conductive elements, each extending through a respective one of the holes;
- a first electro-optical chip on the top surface of the photonic integrated circuit;
- and a second electro-optical chip on the top surface of the photonic integrated circuit, wherein the waveguide is optically coupled between the first and second electro-optical chips.
2 more elements
Dependencies are inferred from the claim text.