Photosensitive resin film, printed wiring board, and semiconductor package
AssigneeResonac Corporation
InventorsKohei ABE, Ryo YUKIOKA, Takeshi NOJIRI, Masahiro MIYASAKA, Hayato SAWAMOTO
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Abstract
A photosensitive resin film containing (A) a photopolymerizable compound having an ethylenically unsaturated group and an acidic substituent and (B) an inorganic filler, in which the amount of the inorganic filler (B) contained is 25% by volume or more, and in which the cured product of the photosensitive resin film has a refractive index of 1.550 or more, and a printed wiring board and a semiconductor package each using the photosensitive resin film.
Claims11
A photosensitive resin film comprising (A) a photopolymerizable compound having an ethylenically unsaturated group and an acidic substituent and (B) an inorganic filler,
- wherein the amount of the inorganic filler (B) contained is 25% by volume or more, and
- wherein the cured product of the photosensitive resin film has a refractive index of 1.550 or more.
Dependencies are inferred from the claim text.