H05K 2201/0212
Resin particles
H05K2201/0212 (Resin particles) appears on 316 US grants and 314 published applications in this corpus.
Search patents in H05K- Granted patents
- 316
- Published applications
- 314
- Assignees
- 187
- Inventors
- 842
- Latest grant
- 18 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 1 | 0 |
| 1979 | 1 | 0 |
| 1980 | 2 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 2 | 0 |
| 1989 | 1 | 0 |
| 1990 | 1 | 0 |
| 1991 | 4 | 0 |
| 1992 | 3 | 0 |
| 1993 | 4 | 0 |
| 1994 | 6 | 0 |
| 1995 | 5 | 0 |
| 1996 | 6 | 0 |
| 1997 | 3 | 0 |
| 1998 | 9 | 0 |
| 1999 | 12 | 0 |
| 2000 | 10 | 0 |
| 2001 | 19 | 6 |
| 2002 | 13 | 14 |
| 2003 | 11 | 18 |
| 2004 | 12 | 14 |
| 2005 | 14 | 30 |
| 2006 | 13 | 16 |
| 2007 | 11 | 19 |
| 2008 | 8 | 14 |
| 2009 | 12 | 21 |
| 2010 | 8 | 18 |
| 2011 | 12 | 11 |
| 2012 | 13 | 4 |
| 2013 | 6 | 5 |
| 2014 | 7 | 8 |
| 2015 | 6 | 4 |
| 2016 | 3 | 4 |
| 2017 | 6 | 6 |
| 2018 | 2 | 6 |
| 2019 | 6 | 6 |
| 2020 | 0 | 6 |
| 2021 | 10 | 17 |
| 2022 | 8 | 15 |
| 2023 | 15 | 16 |
| 2024 | 9 | 24 |
| 2025 | 12 | 8 |
| 2026 | 9 | 4 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Camera module packaging structure and electronic device having the same18 Aug 2026US 12,713,521 B2Triple Win Technology(Shenzhen) Co. Ltd.
- Micro light-emitting package11 Aug 2026US 12,707,562 B2Ennostar Corporation
- Protection circuit unit and method of bonding lead portions and protection circuit unit7 Jul 2026US 12,677,374 B2LG Energy Solution, Ltd.
- Electronic device and product5 May 2026US 12,621,961 B2
- Method for producing electrical circuitry on filled organic polymers14 Apr 2026US 12,604,413 B2
- Resin composition, prepreg, metal foil-clad laminate and printed circuit board16 Jul 2026US 2026/0206133 A1Zeon Corporation
- Printed wiring board30 Apr 2026US 2026/0122793 A1Ibiden Co., Ltd.
- Copper-clad laminate having low dielectric constant, low dielectric loss and high thermal conductivity and method for manufacturing the same23 Apr 2026US 2026/0113853 A1CRHM Co., Ltd.
- Coating agent and electronic component module manufacturing method9 Apr 2026US 2026/0101430 A1Sekisui Chemical Co., Ltd.
- Roll-type flexible metal laminate, method for manufacturing the same, and printed circuit board comprising the flexible metal laminate18 Dec 2025US 2025/0386435 A1Doosan Corporation
Most cited
By later US patents
- Semiconductor device having compliant columnar electrical connections219US 5,468,995 AMotorola, Inc. · 1995
- Thin stacked integrated circuit device208US 6,137,164 ATexas Instruments Incorporated · 2000
- Electrically conductive adhesive connecting arrays of conductors165US 4,113,981 ASeikosha Co., Ltd. · 1978
- Rolling ball connector149US 6,358,627 B2International Business Machines Corporation · 2002
- Composite bump flip chip bonding138US 5,431,328 AIndustrial Technology Research Institute · 1995