US 5,468,995 A · Semiconductor device having compliant columnar electrical connections

Abstract

An array type semiconductor device (10 and 40) has compliant polymer columnar I/O connections (30) to accommodate thermally induced stress during device operation. The device has a semiconductor die (22) mounted to a substrate (12) and electrically connected thereto. A package body (28, 46) covers the semiconductor die and electrical connections (26, 42) to provide mechanical protection. The I/O contacts are formed from a polymer core (34) that is metallized to impart electrical conductivity to the contacts. The metallization (36, 38) may either be a plating around the polymer core or fillers embedded in the polymer. The aspect ratio of the polymer contacts is greater than one to provide compliance while maintaining high I/O density in the array. The metallized polymer contacts may be attached to the package substrate and to a PWB with joints (32) composed of either solder or a conductive adhesive.

Claims13

Dependent claims

A semiconductor device comprising:

a semiconductor die;
a substrate having a die mounting area, a plurality of conductive traces, and a plurality of conductive lands connected to the plurality of conductive traces, wherein the semiconductor die is mounted in the die mounting area;
means for electrically connecting the semiconductor die to the plurality of conductive traces;
a package body covering the semiconductor die and the means for electrically connecting the semiconductor die;
and
a plurality of elongated external electrical connections connected to the plurality of conductive lands by way of a plurality of conductive joints, wherein each elongated external electrical connection comprises an innermost polymeric core which has a length and a width, the length being greater than the width, and an outer metallic coating along the length of each innermost polymeric core.

3 more elements

A semiconductor device comprising:

a semiconductor die;
a substrate having a die mounting surface, a plurality of conductive traces, and a plurality of conductive lands connected to the plurality of conductive traces, wherein the semiconductor die is mounted on the die mounting surface of the substrate and is electrically connected to the plurality of conductive traces;
a package body covering the semiconductor die;
and
a plurality of elongated external electrical connections connected to the plurality of conductive lands by way of a plurality of conductive joints, wherein each elongated external electrical connection comprises an innermost polymeric core which has a length and width, the length being greater than the width, a first outer metallic coating along the length of each innermost polymeric core, and a second outer metallic coating covering the first outer metallic coating.

2 more elements

Dependencies are inferred from the claim text.

Semiconductor device having compliant columnar electrical connections

Life of this patent

Semiconductor device having compliant columnar electrical connections

Life of this patent

Abstract

Claims13