US 5,431,328 A · Composite bump flip chip bonding

Abstract

A bonded structure comprising the physical and electrical connections between an integrated circuit element and substrate using a composite bump comprised of a single polymer body of low Young's Modulus, a conductive barrier metal coating covering the polymer body and a soldering metal coating covering the conductive barrier metal coating. When the bonded structure is formed the composite bump is deformed and the low Young's Modulus of the polymer body allows a very reliable bonded structure with very low bonding force. Due to the low Young's Modulus there is little stress tending to break the solder joint after the bonded structure is formed. The bond is formed using a soldering process so that the soldering metal forms a conductive adhesive between the composite bumps and either the substrate input/output pads or the integrated circuit element input/output pads.

Claims12

Dependent claims

A method for forming a bonded structure, comprising:

providing an integrated circuit element with input/output pads;
providing a single polymer body on each said integrated circuit element input/output pad wherein the cross section area of said single polymer body on said integrated circuit element input/output pad is smaller than that of said integrated circuit element input/output pad;
providing a conductive metal coating upon said single polymer body and covering said integrated circuit element input/output pad wherein each said single polymer body and said coductive metal coating comprises a composite bump;
providing a substrate with input/output pads;
providing a soldering metal;
bringing together said composite bumps formed on said integrated circuit element input/output pads, said substrate input/output pads, and said soldering metal;
heating said soldering metal to a temperature of about 30.degree. C. above the melting point of said soldering metal;
and
cooling said soldering metal below the melting point of said soldering metal.

6 more elements

Dependencies are inferred from the claim text.

Composite bump flip chip bonding

Life of this patent

Composite bump flip chip bonding

Life of this patent

Abstract

Claims12