Coating agent and electronic component module manufacturing method

Abstract

Provided is a coating agent capable of forming a coating film having high heat insulating properties. The coating agent according to the present invention is a coating agent used for forming a coating film in an electronic component module in which an electronic component is mounted on a circuit board via a conductive adhesive portion, the conductive adhesive portion being coated with a coating film, the coating agent includes a thermoplastic resin, a solvent that dissolves the thermoplastic resin, and hollow particles, in which a content of the thermoplastic resin is 1.0 wt % or more and 22.0 wt % or less based on 100 wt % of a total content of the thermoplastic resin and the solvent, and a content of the hollow particles is 15.0 parts by weight or more and 50.0 parts by weight or less based on 100 parts by weight of the total content of the thermoplastic resin and the solvent.

Dependencies are inferred from the claim text.