Back to results
US 12,707,562 B2Granted
Micro light-emitting package
AssigneeEnnostar Corporation
InventorsHsin-Lun Su, Jo-Hsiang Chen, Chun-Min Lin
Life of this patent
Estimating the term…
Abstract
A micro light-emitting package is provided. The micro light-emitting package includes a multilayer resin wiring board, a plurality of micro LED chips, and an encapsulating layer. The multilayer resin wiring board includes a black resin structure and a conductive structure disposed in the black resin structure. The plurality of the micro LED chips is arranged on the multilayer resin wiring board and electrically-connected to the conductive structure. The encapsulating layer covers the plurality of the micro LED chips.
Claims11
A micro light-emitting package, comprising:
- a multilayer resin wiring board comprising:
- a black resin structure;
- and
- a conductive structure disposed in the black resin structure and comprising a first conductive layer, a first via conductor, a second conductive layer with a topmost surface, and a second via conductor;
- a plurality of micro LED chips arranged on the multilayer resin wiring board and electrically connected to the conductive structure;
- and
- an encapsulating layer covering the plurality of micro LED chips,
- wherein the topmost surface has a portion overlapping the first via conductor, and completely covered by the black resin structure in a vertical direction.
5 more elements
Dependencies are inferred from the claim text.