H05K 2201/0215
Metallic fillers
H05K2201/0215 (Metallic fillers) appears on 282 US grants and 320 published applications in this corpus.
Search patents in H05K- Granted patents
- 282
- Published applications
- 320
- Assignees
- 205
- Inventors
- 845
- Latest grant
- 25 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 1 | 0 |
| 1987 | 8 | 0 |
| 1988 | 3 | 0 |
| 1989 | 1 | 0 |
| 1990 | 0 | 0 |
| 1991 | 6 | 0 |
| 1992 | 3 | 0 |
| 1993 | 2 | 0 |
| 1994 | 5 | 0 |
| 1995 | 3 | 0 |
| 1996 | 4 | 0 |
| 1997 | 3 | 0 |
| 1998 | 1 | 0 |
| 1999 | 2 | 0 |
| 2000 | 5 | 0 |
| 2001 | 9 | 3 |
| 2002 | 15 | 13 |
| 2003 | 7 | 9 |
| 2004 | 9 | 18 |
| 2005 | 4 | 21 |
| 2006 | 10 | 15 |
| 2007 | 9 | 10 |
| 2008 | 6 | 16 |
| 2009 | 10 | 18 |
| 2010 | 12 | 18 |
| 2011 | 15 | 10 |
| 2012 | 10 | 7 |
| 2013 | 8 | 9 |
| 2014 | 4 | 7 |
| 2015 | 9 | 15 |
| 2016 | 7 | 16 |
| 2017 | 8 | 13 |
| 2018 | 12 | 12 |
| 2019 | 8 | 11 |
| 2020 | 6 | 12 |
| 2021 | 10 | 15 |
| 2022 | 10 | 11 |
| 2023 | 9 | 9 |
| 2024 | 8 | 16 |
| 2025 | 8 | 7 |
| 2026 | 7 | 9 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Device having an in-substrate inductor and method for making the inductor25 Aug 2026US 12,720,774 B2QUALCOMM Incorporated
- Flexible printed circuit, ink and method for obtaining flexible printed circuit thereof11 Aug 2026US 12,707,565 B2Universidade De Coimbra
- Crosstalk noise reduction by high permeability insulator2 Jun 2026US 12,648,458 B2International Business Machines Corporation
- Wiring board7 Apr 2026US 12,598,700 B2KYOCERA Corporation
- Curable adhesive composition for die attach31 Mar 2026US 12,590,228 B2Henkel AG & Co. KGaA
- Inlay, Component Carrier, and Method of Manufacturing the Inlay17 Sep 2026US 2026/0282220 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Film, laminated film, laminated plate, printed wiring board, antenna substrate, antenna module, metamaterial, and electromagnetic wave absorbing film20 Aug 2026US 2026/0247529 A1FUJIFILM Corporation
- Wiring substrate and method for manufacturing the same6 Aug 2026US 2026/0231331 A1Ibiden Co., Ltd.
- Printed circuit board with healable features25 Jun 2026US 2026/0181767 A1SanDisk Technologies LLC
- Printed circuit board12 Mar 2026US 2026/0075711 A1Samsung Electro-Mechanics Co., Ltd.
Most cited
By later US patents
- Semiconductor package280US 8,921,990 B2Samsung Electronics Co., Ltd. · 2014
- Chip carrier mounting device187US 4,705,205 ARaychem Corporation · 1987
- Compliant interconnection and method therefor183US 4,642,889 AAMP Incorporated · 1987
- Chip mounting device154US 4,664,309 ARaychem Corporation · 1987
- Solder ball interconnected assembly129US 5,591,941 AInternational Business Machines Corporation · 1997