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US 12,648,458 B2Granted
Crosstalk noise reduction by high permeability insulator
AssigneeInternational Business Machines Corporation
InventorHiroyuki Mori
Life of this patent
Estimating the term…
Abstract
An electrical device is provided that includes a wiring level including a plurality of metal lines, and an dielectric filling a space between adjacent metal lines in the plurality of metal lines of the wiring level. The dielectric comprises an epoxy composition having a filler of magnetic fillers. The dielectric has a permeability that reduces crosstalk noise between the adjacent metal lines in the plurality of metal lines of the wiring level.
Claims20
An electrical device comprising:
- a wiring level including a plurality of metal lines;
- a first dielectric layer below the wiring level;
- a second dielectric layer above the wiring level;
- and
- a dielectric filling a space between adjacent metal lines in the plurality of metal lines of the wiring level, wherein the dielectric comprises an epoxy composition having magnetic fillers, and wherein a composition of the first dielectric layer and a composition of the second dielectric layer are different from the epoxy composition of the dielectric filling the space between the adjacent metal lines.
2 more elements
An electrical device comprising:
- a wiring level including a plurality of metal lines;
- a first dielectric layer below the wiring level;
- a second dielectric layer above the wiring level;
- and
- a dielectric filling a space between adjacent metal lines in the plurality of metal lines of the wiring level, wherein the dielectric comprises a thermosetting resin composition having magnetic fillers that have a cobalt, zirconium and niobium containing composition, and wherein a composition of the first dielectric layer and a composition of the second dielectric layer are different from the thermosetting resin composition of the dielectric filling the space between the adjacent metal lines.
2 more elements
A method for forming a wiring level of an electrical device comprising:
- forming a first dielectric layer;
- forming a plurality of metal lines for the wiring level above the first dielectric layer,
- filling a space between adjacent metal lines in the plurality of metal lines of the wiring level with a dielectric material, wherein the dielectric material comprises an epoxy composition having magnetic fillers;
- and
- forming a second dielectric layer above the wiring level, wherein a composition of the first dielectric layer and a composition of the second dielectric layer are different from the epoxy composition of the dielectric filling the space between the adjacent metal lines.
2 more elements
Dependencies are inferred from the claim text.