Chip mounting device

An apparatus for providing a plurality of discrete quantities of preformed colulmns of joint-forming material for forming connections between sets of vertically-spaced electrically-conductive elements of an electrical device, each set of conductive elements distributed in a pattern, comprising:

• a dissolvable retaining member having a pattern of apertures homologous with the patterns of conductive elements;
• preforms having a slender column configuration and comprising solder material disposed in the apertures, the preforms having a predefined elongated configuration with a height dimension greater than its transverse cross-sectonal dimension;
• and
• wherein the preforms extend sufficiently from the surfaces of the retaining member whereby the preforms contact the conductive elements and the retaining member does not contact the conductive elements or the electrical device.

A method for simultaneously forming a resilient connection between each electrically-conductive element of a first pattern of such elements and each electrically-conductive element of a second pattern of such elements, said first and second patterns of elements being homologous and vertically spaced, comprising:

• providing a preform of connection-forming material between each of said elements on the first and the second patterns of elements such that each preform is associated with an element of the first pattern and the homologous element of the second pattern, the preform having a predefined elongated configuration with a height dimension greater than its transverse cross-sectonal dimension;
• effecting a bond between each preform and the set of conductive elements associated with the preform, each preform maintaining its predefined configuration during the bonding;
• and
• wherein the providing of the preforms is effected by positioning a retaining member which comprises a layer of heat-recoverable material between the first and the second patterns of conductive elements, the retaining member having a plurality of apertures distributed in a pattern homologous with the pattern of conductive elements, with the preforms being disposed within the apertures.

A method for providing a resilient connection on each electrically-conductive element of a pattern of such elements, comprising:

• providing a preform of connection-forming material in contact with each of said elements on the pattern of elements, the preform having a predefined elongated configuration with a height dimension greater than its transverse cross-sectional dimension;
• effecting a bond between each preform and each conductive elements associated with the preform, each preform maintaining its predefined configuration during the bond;
• and
• wherein the providing of the preforms is effected by positioning a retaining member which comprises a layer of heat-recoverable material in position relative to the pattern of conductive elments, the retaining member having a plurality of apertures distributed in a patter homologous with the patterns of conductive elements, with the preforms being disposed within the apertures.

A method for providing a resilient connection on each electrically-conductive element of a pattern of such elements of an electrical device, comprising:

• providing a preform having a slender configuration and comprising solder material in contact with each of said elements on the pattern of elements, the preform having a predefined elongated configuration with a height dimension greater than its transverse cross-sectional dimension;
• effecting a bond between each preform and each conductive elements associated with the preform, each preform maintaining its predefined configuration during the bonding;
• and
• wherein the providing of the preforms is effected by positioning a retaining member which is dissolvable in position relative to the pattern of conductive elements, the retaining member having a plurality of apertures distributed in a pattern homoglous with the patterns of conductive elements, with the preforms being disposed within the apertures and extending from the surfaces of the retaining member whereby the preforms contact the conductive elements and the retaining member does not contact the conductive elements or the electrical device.