Solder ball interconnected assembly

A fabricated interconnect assembly comprising:

• a first and second interconnect substrates;
• a planer pattern of multiple, metal contacts on each respective substrate, for interconnection between the substrates, which are mirror images of each other to provide confronting pairs of contacts;
• a ball of conductive metal for respective pairs of such contacts with a diameter about the same as the width of the contacts;
• and
• a volume of a first joining-material for each such pair of contacts connected to the respective contact of the first interconnect substrate and a volume of a second joining-material for each such pair of contacts connected to the respective contact of the second interconnect substrate, with melting temperatures of the first and second joining-materials both substantially less than the melting temperature of the metal-balls, with the volumes of the first and second joining-materials of each pair of contacts connected to approximately diametrically opposite ends of a respective metal-ball, and with the melting temperatures of the first and second joining-materials being about equal.

An interconnect structure for connection to a plane of contacts comprising:

• a substrate;
• a planer pattern of multiple, metal contacts for interconnecting the substrate, to another substrate with a mirror image pattern of contacts;
• balls of conductive metal for respective contacts with ball a diameter about the same as the width of the contacts with confronting ends of the balls at respective contacts and distal, exposed ends for connection to the mirror image contacts of another substrate;
• and
• an isolated volume of a joining-material connected between the confronting end of each metal ball and the respective contact for that metal ball, with a melting temperature of the joining-material substantially less than the melting temperature of the metal-ball, and with the smallest cross sectional area of the joining-material volumes having a minimum diameter at least about 2/3 of the diameter of the metal-ball.

A fabricated interconnect structure comprising:

• a multi-layer substrate having a wiring layer at the surface of the substrate;
• a multitude of metal contacts in a matrix at positions in the wiring layer defined by intersections of a grid of a multitude of approximately parallel about equally spaced lines in each of two about perpendicular directions in a plane of the surface wiring layer;
• a multitude of conducting vias connecting between one or more other wiring layers of the substrate and the surface wiring layer at about the centers of squares defined by four of the contacts;
• and
• a conductor of the surface wiring layer for each respective via, which is narrower than the contacts, and extends in a diagonal direction of the square to connect between the via and one of the four contacts surrounding the via.

An information handling system comprising:

• one or more central processing units connected in a network;
• random access memory communicating through a bus with each central processor unit;
• input/output means for communication between processor units and with computer peripherals;
• a circuit board in communication with one or more of the central processing units, with a planer pattern of round, metal contacts having a diameter of about 0.6 mm to about 1.0 mm on a major surface;
• a chip carrier for one or more chips, with a planer pattern of multiple, metal contacts on a major surface, which pattern is approximately a mirror image of a planer pattern of contacts on the circuit board to provide confronting pairs of contacts for interconnection between the carrier and the board and which are also about 0.5 mm to about 1.0 mm in width;
• a metal-ball for each respective pair of such contacts with a diameter of about 0.6 mm to about 1.3 mm;
• and
• a volume of a first joining-material for each pair of contacts connected to a respective contact of the chip carrier and a volume of a second joining-material for each pair of contacts connected to a respective contact of the circuit board, with melting temperatures of both the first and second joining-material substantially less than the melting temperature of the metal-balls, with the first and second joining-materials of each pair of contacts soldered to diametrically opposite ends of the respective metal-ball.

Information handling apparatus comprising:

• one or more central processing units connected in a network;
• random access memory communicating through a bus with each central processor unit;
• input/output means for communicating with computer peripherals;
• a multi-layer circuit board in communication with one or more of the central processing units, having a wiring layer on the surface of the circuit board;
• a multitude of metal contacts in a planer matrix pattern at positions defined by intersections of a grid of a multitude of approximately parallel about equally spaced lines in each of two perpendicular directions in a plane of the surface wiring layer;
• a multitude of conducting vias connecting between one or more other wiring layers of the circuit board and the surface wiring layer at about the centers of squares defined by four of the contacts;
• a conductor of the surface wiring layer for each respective via, which is narrower than the contacts, and extends in a diagonal direction of the square to connect between the via and one of the four contacts surrounding the via;
• a chip carrier for one or more chips with a planer pattern of multiple, metal contacts on a major surface which is approximately a mirror image of a planer pattern of contacts on the circuit board to provide confronting pairs of contacts for interconnection between the carrier and the board;
• a metal-ball for each respective pair of such contacts;
• and a volume of a first joining-material for each pair of contacts connected to a respective contact of the chip carrier and a volume of a second joining-material for each pair of contacts connected to a respective contact of the circuit board, with melting temperatures of both the first and second joining-material substantially less than the melting temperature of the metal-balls, with the first and second joining-materials of each pair of contacts soldered to diametrically opposite ends of the respective metal-ball.

Interconnect apparatus comprising:

• a first and second interconnect substrates;
• a planer pattern of multiple, metal contacts on each respective substrate for interconnection between the substrates, which are mirror images of each other to provide confronting pairs of contacts;
• a column of conductive metal for respective pairs of such contacts with a diameter about the same as the width of the contacts and positioned with a longitudinal axis perpendicular to the plane of contacts;
• and
• a volume of a first joining-material for each such pair of contacts connected to the respective contact of the first interconnect substrate and a volume of a second joining-material for each such pair of contacts connected to the respective contact of the second interconnect substrate, with melting temperatures of the joining-materials of both the first and second volumes substantially less than the melting temperature of the metal-columns, with the first and second volumes of each pair of contacts connected to opposite ends of a respective metal-column.

Fabricated interconnect apparatus comprising:

• a substrate;
• a planer pattern of multiple, metal contacts for interconnecting the substrate to another substrate with mirror image contacts;
• a column of conductive metal for each contact with a diameter about the same as the width of the contacts and positioned about perpendicular to the plane of contacts;
• and
• a volume of a joining-material connected between each respective contact and the respective metal-column for that contact, with a melting temperature of the joining-material substantially less than the melting temperature of the metal-column.

An interconnect structure comprising a first substrate with a first about planer area array of contacts and a second substrate with a second about planer area array of contacts, which second array is about parallel to the plane of the first area array of contacts in positions corresponding to positions of the first area array of contacts;

• and
• solder extending between a pair of corresponding contacts, including
• a first and second cross-sections parallel to the plane of the contacts, with a narrower width than either of the respective contacts of the pair;
• and
• a third cross-section parallel to the plane of the contacts, between the first and second cross-sections, with a width wider than the width of either of the respective contacts of the pair.