Wiring substrate and method for manufacturing the same
AssigneeIbiden Co., Ltd.
InventorTakema ADACHI
Life of this patent
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Abstract
A wiring substrate includes a core substrate including a main body and a magnetic resin body, and through-hole conductors formed in the magnetic resin body in the core substrate such that the through-hole conductors are penetrating through the magnetic resin body in the core substrate. The core substrate is formed such that an inter-conductor material is positioned between the through-hole conductors in the magnetic resin body and that the inter-conductor material has magnetism that is lower than magnetism of the magnetic resin body or is non-magnetic.
Claims20
A wiring substrate, comprising:
- a core substrate comprising a main body and a magnetic resin body;
- and
- a plurality of through-hole conductors formed in the magnetic resin body in the core substrate such that the plurality of through-hole conductors is penetrating through the magnetic resin body in the core substrate,
- wherein the core substrate is formed such that an inter-conductor material is positioned between the through-hole conductors in the magnetic resin body and that the inter-conductor material has magnetism that is lower than magnetism of the magnetic resin body or is non-magnetic.
A method for manufacturing a wiring substrate, comprising:
- forming an accommodating portion in a main body of a core substrate;
- filling the accommodating portion formed in the main body of the core substrate with a magnetic resin body paste such that a magnetic resin body is formed in the core substrate;
- forming a plurality of through-hole conductors in the magnetic resin body of the core substrate such that the plurality of through-hole conductors penetrates through the magnetic resin body in the core substrate;
- and
- forming an inter-conductor material in the core substrate such that the inter-conductor material is positioned between the through-hole conductors in the magnetic resin body of the core substrate and that the inter-conductor material has magnetism that is lower than the magnetic resin body or is non-magnetic.
Dependencies are inferred from the claim text.