H05K 2201/0239
Coupling agent for particles
H05K2201/0239 (Coupling agent for particles) appears on 159 US grants and 136 published applications in this corpus.
Search patents in H05K- Granted patents
- 159
- Published applications
- 136
- Assignees
- 113
- Inventors
- 441
- Latest grant
- 16 Dec 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 1 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 2 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 2 | 0 |
| 1987 | 2 | 0 |
| 1988 | 1 | 0 |
| 1989 | 3 | 0 |
| 1990 | 2 | 0 |
| 1991 | 3 | 0 |
| 1992 | 5 | 0 |
| 1993 | 3 | 0 |
| 1994 | 8 | 0 |
| 1995 | 3 | 0 |
| 1996 | 5 | 0 |
| 1997 | 6 | 0 |
| 1998 | 1 | 0 |
| 1999 | 2 | 0 |
| 2000 | 4 | 0 |
| 2001 | 9 | 1 |
| 2002 | 3 | 7 |
| 2003 | 8 | 6 |
| 2004 | 4 | 11 |
| 2005 | 4 | 9 |
| 2006 | 5 | 8 |
| 2007 | 6 | 9 |
| 2008 | 1 | 12 |
| 2009 | 8 | 10 |
| 2010 | 7 | 14 |
| 2011 | 5 | 8 |
| 2012 | 7 | 5 |
| 2013 | 8 | 3 |
| 2014 | 4 | 7 |
| 2015 | 5 | 9 |
| 2016 | 9 | 2 |
| 2017 | 0 | 1 |
| 2018 | 2 | 1 |
| 2019 | 1 | 2 |
| 2020 | 0 | 4 |
| 2021 | 1 | 1 |
| 2022 | 3 | 0 |
| 2023 | 1 | 1 |
| 2024 | 0 | 2 |
| 2025 | 2 | 1 |
| 2026 | 0 | 2 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Photosensitive resin composition, photosensitive resin film, multilayered printed wiring board, semiconductor package, and method for producing multilayered printed wiring board16 Dec 2025US 12,498,636 B2Resonac Corporation
- Laminate, electronic equipment and production method for laminate7 Jan 2025US 12,187,012 B2Jnc Corporation
- Prepreg, metal-clad laminate, and wiring board21 Nov 2023US 11,820,105 B2Panasonic Intellectual Property Management Co., Ltd.
- Thermally conductive flexible adhesive for aerospace applications5 Apr 2022US 11,292,943 B2The Boeing Company
- Thermosetting resin composition, prepreg, laminate, and printed circuit board1 Mar 2022US 11,261,305 B2Shengyi Technology Co., Ltd.
- Metallic Paste for Ceramic Substrate6 Aug 2026US 2026/0231324 A1CeramTec GmbH
- Copper-clad laminate having low dielectric constant, low dielectric loss and high thermal conductivity and method for manufacturing the same23 Apr 2026US 2026/0113853 A1CRHM Co., Ltd.
- Wiring board, electronic device, and electronic module15 May 2025US 2025/0159799 A1KYOCERA Corporation
- Bismaleimide composition, cured product, sheet, laminated body, and flexible printed wiring board22 Aug 2024US 2024/0278536 A1
- Resin composition, prepreg, resin-coated film, resin-coated metal foil, metal-clad laminate, and wiring board6 Jun 2024US 2024/0182657 A1Panasonic Intellectual Property Management Co., Ltd.
Most cited
By later US patents
- Preparation method of anisotropic conductive adhesive for flip chip interconnection on organic substrate104US 6,238,597 B1Korea Advanced Institute of Science and Technology · 2001
- Electrical substrate material100US 4,849,284 ARogers Corporation · 1989
- Flame retardant, low dielectric constant microsphere filled laminate87US 5,126,192 AInternational Business Machines Corporation · 1992
- Method for mounting parts on circuit boards74US 4,208,005 AHitachi, Ltd. · 1980
- Particulate filled composite film and method of making same70US 5,506,049 ARogers Corporation · 1996