Thermosetting resin composition, prepreg, laminate, and printed circuit board
AssigneeShengyi Technology Co., Ltd.
InventorsGuangbin Chen, Qianfa Liu, Shanyin Yan, Xianping Zeng, Cuiming Du
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Abstract
A thermosetting resin composition, a prepreg, a laminate, and a printed circuit board are provided. The thermosetting resin composition has a thermosetting polyphenylene ether resin, an unsaturated polyolefin resin, a curing agent, and hollow borosilicate microspheres with surfaces treated with a bromine-containing silane coupling agent. The laminate produced from the thermosetting resin composition satisfies the requirements for overall properties such as low dielectric constant, low dielectric loss, low water absorption rate, high peeling strength, and the like for a high-frequency electronic circuit substrate.
Claims17
A thermosetting resin composition, comprising the following components:
- (1) a thermosetting polyphenylene ether resin;
- (2) an unsaturated polyolefin resin;
- (3) a curing agent;
- and
- (4) hollow borosilicate microspheres with surfaces treated with a bromine-containing silane coupling agent,
- wherein the bromine-containing silane coupling agent is represented by formula (BrR21)Si(OR22)(OR23)(OR24), wherein R21 represents an alkyl group having a carbon atom number of 1 to 10, and R22, R23, and R24 each independently represent an alkyl group having a carbon atom number of 1 to 4.
Dependencies are inferred from the claim text.