Bismaleimide composition, cured product, sheet, laminated body, and flexible printed wiring board
OwnerKitaru SATO, Takaaki SAKAI +3inventors
InventorsKitaru SATO, Takaaki SAKAI, Kenji FURUYA, Hideyuki MAEDA, Hiroshi KODAIRA
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Abstract
Provided is a bismaleimide composition including: a bismaleimide resin (A) having a structure derived from an aromatic tetracarboxylic acid (a1), a dimer diamine (a2), and a maleic anhydride (a3); and silica particles (B) surface-treated with phenylaminosilane, in which the silica particles (B) have an average particle diameter of 100 nm or less, the silica particles (B) have an maximum aggregation particle size of 20 μm or less, and a content of the silica particles (B) is 15% by mass or less based on a total solid content of the composition.
Claims11
A bismaleimide composition comprising:
- a bismaleimide resin (A) having a structure derived from an aromatic tetracarboxylic acid (a1), a dimer diamine (a2), and a maleic anhydride (a3);
- and
- silica particles (B) surface-treated with phenylaminosilane,
- wherein the silica particles (B) have an average particle diameter of 100 nm or less,
- the silica particles (B) have a maximum aggregation particle size of 20 μm or less, and
- a content of the silica particles (B) is 15% by mass or less based on a total solid content of the composition.
Dependencies are inferred from the claim text.