H05K 2201/0236
Plating catalyst as filler in insulating material
H05K2201/0236 (Plating catalyst as filler in insulating material) appears on 106 US grants and 117 published applications in this corpus.
Search patents in H05K- Granted patents
- 106
- Published applications
- 117
- Assignees
- 82
- Inventors
- 263
- Latest grant
- 25 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 2 | 0 |
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 2 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 1 | 0 |
| 1989 | 1 | 0 |
| 1990 | 2 | 0 |
| 1991 | 0 | 0 |
| 1992 | 2 | 0 |
| 1993 | 2 | 0 |
| 1994 | 2 | 0 |
| 1995 | 2 | 0 |
| 1996 | 2 | 0 |
| 1997 | 0 | 0 |
| 1998 | 2 | 0 |
| 1999 | 5 | 0 |
| 2000 | 0 | 0 |
| 2001 | 1 | 0 |
| 2002 | 0 | 1 |
| 2003 | 2 | 2 |
| 2004 | 2 | 4 |
| 2005 | 0 | 2 |
| 2006 | 3 | 4 |
| 2007 | 0 | 3 |
| 2008 | 3 | 3 |
| 2009 | 1 | 4 |
| 2010 | 1 | 9 |
| 2011 | 4 | 8 |
| 2012 | 4 | 6 |
| 2013 | 3 | 3 |
| 2014 | 1 | 10 |
| 2015 | 5 | 9 |
| 2016 | 6 | 14 |
| 2017 | 9 | 12 |
| 2018 | 9 | 2 |
| 2019 | 6 | 7 |
| 2020 | 5 | 4 |
| 2021 | 2 | 4 |
| 2022 | 3 | 1 |
| 2023 | 3 | 3 |
| 2024 | 1 | 0 |
| 2025 | 1 | 1 |
| 2026 | 1 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Metal-coated substrates, interposers, and methods for production thereof25 Aug 2026US 12,720,675 B2Kuprion Inc.
- Printed wiring board9 Dec 2025US 12,495,489 B2Ibiden Co., Ltd.
- Circuit structure9 Jul 2024US 12,035,467 B2Ticona LLC
- Circuit structure15 Aug 2023US 11,729,908 B2Ticona LLC
- Method for manufacturing electrically conductive structures on a carrier material8 Aug 2023US 11,718,727 B2Chemische Fabrik Budenheim KG
- Conductive film and display device27 Aug 2026US 2026/0254101 A1TDK Corporation
- Metal-coated substrates, interposers, and methods for production thereof5 Jun 2025US 2025/0185156 A1Kuprion Inc.
- Circuit Structure2 Nov 2023US 2023/0354515 A1Ticona LLC
- Printed wiring board5 Oct 2023US 2023/0319987 A1Ibiden Co., Ltd.
- Circuit Board Traces in Channels using Electroless and Electroplated Depositions30 Mar 2023US 2023/0096301 A1Catlam, LLC
Most cited
By later US patents
- Electronic part and a method of manufacturing the same236US 6,292,139 B1Murata Manufacturing Co., Ltd. · 2001
- Method of manufacturing multilayer printed wiring board145US 5,826,330 AHitachi AIC Inc. · 1998
- Microelectronic circuit substrate structure including photoimageable epoxy dielectric layers100US 5,485,038 AHughes Aircraft Company · 1996
- Integrated circuit substrate having embedded passive components and methods therefor61US 6,987,661 B1Amkor Technology, Inc. · 2006
- Method for making an integrated circuit substrate having embedded passive components54US 7,334,326 B1Amkor Technology, Inc. · 2008