Integrated circuit substrate having embedded passive components and methods therefor

A substrate for a microelectronic circuit, comprising:

• an insulating layer including a plurality of conductive interconnects forming a conductive pattern;
• and
• means for embedding passive components within the insulating layer.

A substrate for a microelectronic circuit, comprising:

• one or more insulating layers, wherein a first one of the insulating layers including one or more apertures for forming passive components having bodies included within the insulating layer, and wherein one of the insulating layers includes a plurality of conductive patterns disposed within channels formed within the second insulating layer;
• and
• at least one capacitor having a paste-formed body formed within a corresponding one of the apertures of the at least one insulating layer, the paste-formed body having a volume substantially filling and in contact with a bottom and side walls of the given aperture, wherein the at least one capacitor includes a metal plated layer at the bottom of the given aperture and wherein the insulating layer includes an activated surface in contact with the metal plated layer.