Microelectronic circuit substrate structure including photoimageable epoxy dielectric layers
AssigneeHughes Aircraft Company
InventorsJames J. Licari, Deborah J. Smith
Life of this patent
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Abstract
A High-Density-Multi-Chip (HDMI) substrate structure (10) includes alternating conductor metallization (24,28,36,54,56) and insulating dielectric layers (14,38). The dielectric layers (14,38) are formed by curtain coating of ultraviolet photoimageable epoxy material, and the metallization (24,28,36,54,56) is formed by electroless plating or sputtering of copper. The dielectric layers (14,38) are photoimaged and developed to form via holes (16,40,44), and vias (18,42,46) are formed in the holes (16,40,44) by electroless copper plating. The metallization (24,28,36,54,56) can be formed in the same manner as the dielectric layers (14,38), or can alternatively be formed by subtractive photolithography using photoresist masks.
Claims7
A microelectronic substrate structure, comprising:
- an electrically conductive substrate having a first patterned epoxy material containing metal ions formed thereon;
- a first dielectric layer of a photoimageable epoxy material having first and second opposite surfaces and a first via hole;
- a second dielectric layer adjacent to said electrically conductive substrate and said first surface of said first dielectric layer, said second dielectric layer having a first through hole that is aligned with said first patterned material and adjacent to and having a larger diameter than said first via hole;
- a first electrical conductor electrolessly plated on said first patterned material in said first through hole of said second dielectric layer;
- an electrically conductive via formed in said first via hole, extending through said first dielectric layer and interconnecting with said first electrical conductor;
- a second patterned epoxy material containing metal ions on said second surface of said first dielectric layer aligned with said electrically conductive via;
- and
- a second electrical conductor electrolessly plated on said second patterned material such that said first electrical conductor electrically interconnects with said second electrical conductor through said electrically conductive via and said first and said second patterned materials.
Dependencies are inferred from the claim text.