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AssigneeAmkor Technology, Inc.
InventorsRonald Patrick Huemoeller, Sukitano Rusli
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A method for making an integrated circuit substrate having embedded passive components provides a reduced cost and compact package for a die and one or more passive components. An insulating layer of the substrate is embossed or laser-ablated to generate apertures for insertion of a paste forming the body of the passive component. A resistive paste is used to form resistors and a dielectric paste is used for forming capacitors. A capacitor plate may be deposited at a bottom of the aperture by using a doped substrate material and activating only the bottom wall of the aperture, enabling plating of the bottom wall without depositing conductive material on the side walls of the aperture. Vias may be formed to the bottom plate by using a disjoint structure and conductive paste technology. Connection to the passive components may be made by conductive paste-filled channels forming conductive patterns on the substrate.
A method of forming a passive component within at least one insulating layer of a semiconductor integrated circuit substrate, the method comprising:
A method of forming a capacitor within at least one insulating layer of a semiconductor integrated circuit substrate, the method comprising:
A method of forming a capacitor within at least one insulating layer of a semiconductor integrated circuit substrate, the method comprising:
A method of forming a substrate for a semiconductor package, the substrate having embedded passive components, the method comprising:
Dependencies are inferred from the claim text.