H05K 2201/0209
Inorganic, non-metallic particles
H05K2201/0209 (Inorganic, non-metallic particles) appears on 1,618 US grants and 1,863 published applications in this corpus.
Search patents in H05K- Granted patents
- 1,618
- Published applications
- 1,863
- Assignees
- 665
- Inventors
- 4,100
- Latest grant
- 22 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 2 | 0 |
| 1978 | 4 | 0 |
| 1979 | 1 | 0 |
| 1980 | 5 | 0 |
| 1981 | 9 | 0 |
| 1982 | 7 | 0 |
| 1983 | 7 | 0 |
| 1984 | 11 | 0 |
| 1985 | 8 | 0 |
| 1986 | 10 | 0 |
| 1987 | 15 | 0 |
| 1988 | 13 | 0 |
| 1989 | 22 | 0 |
| 1990 | 20 | 0 |
| 1991 | 20 | 0 |
| 1992 | 26 | 0 |
| 1993 | 17 | 0 |
| 1994 | 26 | 0 |
| 1995 | 18 | 0 |
| 1996 | 25 | 0 |
| 1997 | 29 | 0 |
| 1998 | 33 | 0 |
| 1999 | 37 | 0 |
| 2000 | 27 | 0 |
| 2001 | 46 | 22 |
| 2002 | 46 | 74 |
| 2003 | 58 | 75 |
| 2004 | 48 | 60 |
| 2005 | 44 | 99 |
| 2006 | 43 | 91 |
| 2007 | 46 | 104 |
| 2008 | 46 | 111 |
| 2009 | 52 | 120 |
| 2010 | 47 | 111 |
| 2011 | 61 | 87 |
| 2012 | 70 | 76 |
| 2013 | 63 | 59 |
| 2014 | 55 | 89 |
| 2015 | 40 | 84 |
| 2016 | 56 | 50 |
| 2017 | 43 | 46 |
| 2018 | 54 | 57 |
| 2019 | 48 | 47 |
| 2020 | 32 | 52 |
| 2021 | 34 | 53 |
| 2022 | 31 | 59 |
| 2023 | 42 | 62 |
| 2024 | 41 | 75 |
| 2025 | 46 | 58 |
| 2026 | 32 | 42 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Wiring board22 Sep 2026US 12,745,348 B2KYOCERA Corporation
- Resin composition and prepreg, film with resin, metal foil with resin, metal-clad laminated plate, and wiring board using same15 Sep 2026US 12,735,543 B2Panasonic Intellectual Property Management Co., Ltd.
- Printed wiring board18 Aug 2026US 12,713,538 B2Ibiden Co., Ltd.
- Circuit board11 Aug 2026US 12,707,563 B2LG Innotek Co., Ltd.
- Structure body and wiring board4 Aug 2026US 12,701,655 B2Taiyo Holdings Co., Ltd.
- Flexible laminate material1 Oct 2026US 2026/0295973 A1The Chemours Company Fc, LLC
- Thermosetting resin composition, prepreg, resin film, metal-clad laminate, printed wiring board, antenna device, antenna module, and communication device24 Sep 2026US 2026/0285008 A1Resonac Corporation
- Resin composition, prepreg, laminate, resin film, printed wiring board, and semi-conductor package24 Sep 2026US 2026/0286119 A1Resonac Corporation
- Resin composition, prepreg, layered sheet, printed circuit board, and semiconductor package17 Sep 2026US 2026/0282221 A1Resonac Corporation
- Prepreg, metal-clad laminate, and wiring board10 Sep 2026US 2026/0264370 A1Panasonic Intellectual Property Management Co., Ltd.
Most cited
By later US patents
- LED lamp assembly with means to conduct heat away from the LEDS470US 6,045,240 ARelume Corporation · 2000
- Vehicle lamp411US 5,038,255 AFurukawa Electric Co., Ltd. · 1991
- Thermally protected LED array337US 5,785,418 A1998
- Component built-in module and method for producing the same277US 6,734,542 B2Matsushita Electric Industrial Co., Ltd. · 2004
- Electronic part and a method of manufacturing the same236US 6,292,139 B1Murata Manufacturing Co., Ltd. · 2001