Component built-in module and method for producing the same

A component built-in module comprising:

• core layer formed of an electric insulating material;
• an electric insulating layer formed on at least one surface of the core layer;
• and
• a wiring pattern formed on a surface of the electric insulating layer;
• wherein:
• the core layer and the electric insulating layer are formed of different electric insulating materials;
• the electric insulating material of the core layer is formed of a mixture comprising at least an inorganic filler and a thermosetting resin;
• at least one selected from the group consisting of active components and passive components is contained in an internal portion of the core layer;
• the core layer has a wiring pattern and an inner via;
• the wiring pattern of the core layer is electrically connected to the wiring pattern formed on the electric insulating layer;
• the electric insulating material formed of the mixture comprising at least an inorganic filler and a thermosetting resin of the core layer has a modulus of elasticity at room temperature in the range from 0.6 GPa to 10 GPa;
• and
• the thermosetting resin comprise a plurality of thermosetting resins having different glass transition temperatures.

A component built-in module comprising:

• a core layer formed of an electric insulating material;
• an electric insulating layer formed on at least one surface of the core layer;
• and
• a wiring pattern formed on a surface of the electric insulating layer;
• wherein:
• the core layer and the electric insulating layer are formed of different electric insulating materials;
• the electric insulating material of the core layer is formed of a mixture comprising at least an inorganic filler and a thermosetting resin;
• at least one selected from the group consisting of active components and passive components is contained in an internal portion of the core layer;
• the core layer has a wiring pattern and an inner via;
• the wiring pattern of the core layer is electrically connected to the wiring pattern formed on the electric insulating layer;
• the electric insulating material formed of the mixture comprising at least an inorganic filler and a thermosetting resin of the core layer has a modulus of elasticity at room temperature in the range from 0.6 GPa to 10 GPa;
• and
• the thermosetting resin comprises at least a thermosetting resin having a glass transition temperature in the range from −20° C. to 60° C. and a thermosetting resin having a glass transition temperature in the range from 70° C. to 170° C.