H05K 2201/0233
Deformable particles
H05K2201/0233 (Deformable particles) appears on 72 US grants and 38 published applications in this corpus.
Search patents in H05K- Granted patents
- 72
- Published applications
- 38
- Assignees
- 47
- Inventors
- 137
- Latest grant
- 31 Mar 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1987 | 1 | 0 |
| 1988 | 2 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 4 | 0 |
| 1992 | 5 | 0 |
| 1993 | 2 | 0 |
| 1994 | 1 | 0 |
| 1995 | 0 | 0 |
| 1996 | 2 | 0 |
| 1997 | 3 | 0 |
| 1998 | 5 | 0 |
| 1999 | 1 | 0 |
| 2000 | 4 | 0 |
| 2001 | 2 | 3 |
| 2002 | 9 | 2 |
| 2003 | 0 | 0 |
| 2004 | 0 | 0 |
| 2005 | 3 | 2 |
| 2006 | 0 | 5 |
| 2007 | 1 | 4 |
| 2008 | 3 | 3 |
| 2009 | 3 | 1 |
| 2010 | 0 | 1 |
| 2011 | 0 | 1 |
| 2012 | 4 | 2 |
| 2013 | 2 | 0 |
| 2014 | 2 | 0 |
| 2015 | 1 | 4 |
| 2016 | 2 | 1 |
| 2017 | 1 | 0 |
| 2018 | 1 | 2 |
| 2019 | 2 | 1 |
| 2020 | 1 | 1 |
| 2021 | 1 | 4 |
| 2022 | 0 | 1 |
| 2023 | 1 | 0 |
| 2024 | 1 | 0 |
| 2025 | 1 | 0 |
| 2026 | 1 | 0 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Curable adhesive composition for die attach31 Mar 2026US 12,590,228 B2Henkel AG & Co. KGaA
- Conductive particles and connection structure29 Apr 2025US 12,288,629 B2Sekisui Chemical Co., Ltd.
- Biphasic material and stretchable circuit board19 Mar 2024US 11,937,372 B2Yale University
- Display device including adhesive film with conductive ball21 Nov 2023US 11,824,034 B2Samsung Display Co., Ltd.
- Liquid ejection apparatus8 Jun 2021US 11,031,538 B2Brother Kogyo Kabushiki Kaisha
- Conductive particles and connection structure18 Aug 2022US 2022/0262537 A1Sekisui Chemical Co., Ltd.
- Biphasic material and stretchable circuit board30 Dec 2021US 2021/0410283 A1Yale University
- Display device16 Sep 2021US 2021/0288015 A1Samsung Display Co., Ltd.
- Stretchable wiring body and stretchable board6 May 2021US 2021/0136912 A1Fujikura Ltd.
- Curable adhesive composition for die attach4 Mar 2021US 2021/0062047 A1Henkel AG & Co. KGaA
Most cited
By later US patents
- UV curable and electrically conductive adhesive for bonding magnetic disk drive components161US 6,947,258 B1Western Digital (Fremont), LLC · 2005
- UV curable and electrically conductive adhesive for bonding magnetic disk drive components153US 6,942,824 B1Western Digital (Fremont), LLC · 2005
- Rolling ball connector149US 6,358,627 B2International Business Machines Corporation · 2002
- Composition for circuit connection, method for connection using the same, and connected structure of semiconductor chips132US 5,001,542 AHitachi Chemical Company, Ltd. · 1991
- Anisotropic-electroconductive adhesive composition, method for connecting circuits using the same, and connected circuit structure thus obtained129US 4,740,657 AHitachi Chemical Company, Ltd. · 1988