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US 5,001,542 AGranted
Composition for circuit connection, method for connection using the same, and connected structure of semiconductor chips
AssigneeHitachi Chemical Company, Ltd.
InventorsIsao Tsukagoshi, Yutaka Yamaguchi, Atsuo Nakajima, Yasushi Goto
Life of this patent
Estimating the term…
Abstract
A composition comprising (A) an epoxy resin type adhesive, (B) particles obtained by coating a nucleus of a curing agent with a film, (C) pressure-deformable electroconductive particles having an average particles size larger than that of the particles (B), and if necessary (D) rigid particles having an average particle size smaller than that of the particles (B), is effective for connecting circuits electrically or connecting a semiconductor chip to a wiring substrate.
Claims14
A composition for circuit connection comprising
- (A) an epoxy resin-containing reactive adhesive,
- (B) coated particles obtained by substantially coating a nucleus of a curing agent with a film, and
- (C) pressure-deformable electroconductive particles having an average particle size larger than that of the coated particles (B)
- the content of the electroconductive particles (C) being 0.1 to 15% by volume based on the total volume of the components (A) and (B), the composition having a chlorine ion concentration in extracted water of 15 ppm or less, and a thermal activation temperature of 40.degree. to 250.degree. C.
1 more element
A composition for circuit connection comprising
- (A) an epoxy resin-containing reactive adhesive,
- (B) coated particles obtained by substantially coating a nucleus of a curing agent with a film,
- (C) pressure-deformable electroconductive particles having an average particle size larger than that of the coated particles (B), and
- (D) rigid particles having an average particle size smaller than that of the coated particles (B),
- the content of the electroconductive particles (D) being 0.1 to 15% by volume based on the total volume of the components (A) and (B), the composition having a chlorine ion concentration in extracted water of 15 ppm or less, and a thermal activation temperature of 40.degree. to 250.degree. C.
2 more elements
Dependencies are inferred from the claim text.