H05K 2201/023
Hard particles, i.e. particles in conductive adhesive at least partly penetrating an
Official title: Hard particles, i.e. particles in conductive adhesive at least partly penetrating an electrode
H05K2201/023 (Hard particles, i.e. particles in conductive adhesive at least partly penetrating an) appears on 44 US grants and 14 published applications in this corpus.
Search patents in H05K- Granted patents
- 44
- Published applications
- 14
- Assignees
- 31
- Inventors
- 84
- Latest grant
- 1 Feb 2022
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 2 | 0 |
| 1988 | 1 | 0 |
| 1989 | 3 | 0 |
| 1990 | 0 | 0 |
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| 1992 | 1 | 0 |
| 1993 | 5 | 0 |
| 1994 | 5 | 0 |
| 1995 | 3 | 0 |
| 1996 | 3 | 0 |
| 1997 | 2 | 0 |
| 1998 | 2 | 0 |
| 1999 | 0 | 0 |
| 2000 | 2 | 0 |
| 2001 | 0 | 0 |
| 2002 | 1 | 1 |
| 2003 | 3 | 0 |
| 2004 | 0 | 2 |
| 2005 | 1 | 1 |
| 2006 | 0 | 0 |
| 2007 | 0 | 0 |
| 2008 | 1 | 0 |
| 2009 | 1 | 0 |
| 2010 | 0 | 0 |
| 2011 | 0 | 2 |
| 2012 | 0 | 1 |
| 2013 | 1 | 0 |
| 2014 | 0 | 1 |
| 2015 | 1 | 1 |
| 2016 | 1 | 1 |
| 2017 | 0 | 0 |
| 2018 | 1 | 0 |
| 2019 | 0 | 1 |
| 2020 | 1 | 1 |
| 2021 | 1 | 0 |
| 2022 | 1 | 0 |
| 2023 | 0 | 1 |
| 2024 | 0 | 1 |
By publication year. Applications have been published since 2001.
Recent patents
- Method for flip-chip bonding using anisotropic adhesive polymer1 Feb 2022US 11,240,918 B2Research & Business Foundation Sungkyunkwan University
- Mounting body manufacturing method and anisotropic conductive film5 Jan 2021US 10,887,999 B2Dexerials Corporation
- Anisotropic conductive film3 Nov 2020US 10,827,625 B2Dexerials Corporation
- Curable composition for electronic component and connection structure27 Mar 2018US 9,928,934 B2Sekisui Chemical Co., Ltd.
- Conductive resin composition, method for manufacturing electronic component using same, bonding method, bonding structure, and electronic component8 Nov 2016US 9,491,868 B2Murata Manufacturing Co., Ltd.
- Battery module including conductive bonding portion for bonding pcb and fpcb, and method of bonding pcb1 Feb 2024US 2024/0039127 A1SK On Co., Ltd.
- Circuit structure for hot-press bonding28 Dec 2023US 2023/0422405 A1Superc-Touch Corporation
- Method for flip-chip bonding using anisotropic adhesive polymer5 Mar 2020US 2020/0077523 A1Research & Business Foundation Sungkyunkwan University
- Anisotropic conductive film21 Mar 2019US 2019/0090354 A1Dexerials Corporation
- Mounting body manufacturing method and anisotropic conductive film27 Oct 2016US 2016/0316569 A1Dexerials Corporation
Most cited
By later US patents
- Electrically conductive adhesive connecting arrays of conductors165US 4,113,981 ASeikosha Co., Ltd. · 1978
- Method of making subsurface electronic circuits121US 5,531,020 APoly-Flex Circuits, Inc. · 1996
- Thermally and electrically conductive adhesive material and method of bonding with same95US 5,328,087 AMicroelectronics and Computer Technology Corporation · 1994
- Anisotropically conductive adhesive composition92US 4,729,809 AAMP Incorporated · 1988
- Conductive adhesive film techniques83US 5,225,966 AAT&T Bell Laboratories · 1993