Anisotropically conductive adhesive composition

A method for electrically connecting one or more conductive areas on one substrate with one or more conductive areas on a second substrate, each substrate having conductive and insulating areas on at least one surface thereof, the method comprising the steps of:

• applying a layer of an anisotropically conductive composition over the conductive and insulating areas on the first substrate, the anisotropically conductive adhesive composition being comprised of a mixture of electrically conductive particles in a nonconductive adhesive binder, at least a portion of the particles being agglomerated into nonaligned, randomly dispersed, self-evidently discrete noncontiguous clusters, the conductive particles being present in a concentration of less than 20 percent by volume exclusive of volatile solvents, the agglomerated clusters and remaining particles being noncontiguous conductive units, said units being sufficiently spaced apart to preclude electrical conductivity between conductive areas on the same substrate;
• aligning the conductive areas on the first substrate with the conductive areas on the second substrate;
• adhering the conductive areas on the first substrate with the conductive areas on the second substrate,
• whereby the noncontiguous conductive units establish electrical connection between the adhered conductive areas on the two substrates.

A product comprised of two or more substrates, each substrate having one or more conductive and insulating areas on at least one surface thereof, the conductive area on a first substrate being electrically connected to a corresponding conductive area on a second substrate, the electrical connection being accomplished by the method of comprising the steps of:

• applying a layer of an anisotropically conductive composition over the conductive insulating areas on the first substrate, the anisotropically conductive adhesive composition being comprised of a mixture of electrically conductive particles in a nonconductive adhesive binder, at least a portion of the particles being agglomerated into nonaligned, randomly dispersed, self-evidently discrete, noncontiguous clusters, the conductive particles being present in a concentration of less than 20 percent by volume exclusive of volatile solvents, said agglomerated clusters and remaining particles being noncontiguous conductive units, said units being sufficiently spaced apart to preclude electrical conductivity between adjacent conductive areas on the same substrate;
• aligning the one or more conductive areas on the first substrate with the one or more conductive areas on the second substrate;
• adhering the one or more conductive areas on the first substrate with the one or more conductive areas on the second substrate,
• whereby the noncontiguous conductive units establish electrical connection between the adhered conductive areas on the two substrates.

A method for electrically connecting at least one conductive area on one substrate with at least one conductive area on a second substrate, each substrate having conductive and insulating areas on at least one surface thereof, the method comprising the steps of:

• applying a layer of an anisotropically conductive composition over the conductive and insulating areas on the first substrate, the anisotropically conductive adhesive composition being comprised of a nonhomogenous mixture of conductive particles in a nonconductive adhesive binder, the conductive particles not requiring a specific shape being dispersed randomly throughout the mixture in noncontiguous, self-evidently discrete, and nonaligned conductive units, each unit being comprised of a plurality of individual particles, the units being sufficiently spaced apart to preclude electrical conductivity between adjacent conductive areas on the same substrate;
• positioning in a conducting relationship said at least one conductive area on the first substrate with said at least one conductive area on the second substrate;
• adhering said at least one conductive area on the first substrate with said at least one conductive area on the second substrate,
• whereby the noncontiguous conductive units establish electrical connection between the adhered conductive areas on the two substrates.