Mounting body manufacturing method and anisotropic conductive film

A method for manufacturing a mounting body, the method comprising:

• a mounting step of mounting a first electronic component onto a wiring board by arranging the first electronic component onto the wiring board via an anisotropic conductive film containing a binder comprising (i) an epoxy resin and (ii) conductive particles having a compressive hardness K of 500 kgf/mm2 or more when compressively deformed by 10%, a relation between a total thickness A of the anisotropic conductive film and an average particle diameter B of the conductive particles being 0.6≤B/A≤1.5;
• a curing step of curing the binder after the mounting step;
• a peeling step of mechanically peeling the first electronic component to detach the first electronic component from the wiring board after the mounting curing step;
• a remounting step of remounting the detached first electronic component, or mounting a second electronic component, onto the wiring board by reusing the wiring board to mechanically remount the detached electronic component, or mechanically mount the second electronic component, onto the wiring board by arranging the detached electronic component, or the second electronic component, onto the wiring board via the mounting step,
• wherein an elastic modulus of the binder at 100° C. after curing is 50 MPa or more.